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  • IEC 61182-2-2:2012

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Withdrawn date:  31-12-2021

    Language(s):  English, English - French

    Published date:  27-04-2012

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 General principles
    5 General rules
    6 Modeling
    7 Report generators
    8 Glossary
    Annex A (normative) - Printed board
            fabrication schema
    Bibliography

    Abstract - (Show below) - (Hide below)

    IEC 61182-2-2:2012 provides the information on the manufacturing requirements used for fabricating printed boards. This standard determines the XML schema details, defined in the generic standard IEC 61182-2 and some of the sectional standards that are required to accomplish the focused tasks. When other standards are invoked, their requirements become a mandatory part of the fabrication details as defined in the IEC 61182-2.

    General Product Information - (Show below) - (Hide below)

    Committee TC 91
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Withdrawn

    Standards Referencing This Book - (Show below) - (Hide below)

    ANSI Y14.5 : 1973 DIMENSIONING AND TOLERANCING FOR ENGINEERING DRAWINGS
    IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
    IEC 61182-2:2006 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements
    IEC 61188-5-3:2007 Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
    IEC 61188-5-2:2003 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
    IPC 2582 : 2007 SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF ADMINISTRATIVE METHODS FOR MANUFACTURING DATA DESCRIPTION
    IEC 61188-5-8:2007 Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
    DOD STD 100 : C NOTICE 6 ENGINEERING DRAWING PRACTICES
    IPC D 325 : A DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS
    IPC 2584 : 2007 SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION
    ISO 10303-212:2001 Industrial automation systems and integration — Product data representation and exchange — Part 212: Application protocol: Electrotechnical design and installation
    IPC 2614 : 0 SECTIONAL REQUIREMENTS FOR BOARD FABRICATION DOCUMENTATION
    IPC 2583 : 2007 SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF DESIGN CHARACTERISTICS FOR MANUFACTURING DATA DESCRIPTION
    ANSI Z210.1 : LATEST METRIC PRACTICE GUIDE
    IPC 7351 : B GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
    IPC 2615 : 0 PRINTED BOARD DIMENSIONS AND TOLERANCES
    IPC 2511 : B GENERIC REQUIREMENTS FOR IMPLEMENTATION OF PRODUCT MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY
    IPC 2588 : 2007 SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PART LIST PRODUCT DATA DESCRIPTION
    IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
    IPC D 310 : C GUIDELINES FOR PHOTOTOOL GENERATION AND MEASUREMENT TECHNIQUES
    IEC 61188-5-6:2003 Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
    IEC 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    IEC 61188-5-5:2007 Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
    IPC 2501 : 0 DEFINITION FOR WEB-BASED EXCHANGE OF XML DATA
    ISO 10303-210:2011 Industrial automation systems and integration Product data representation and exchange Part 210: Application protocol: Electronic assembly, interconnect, and packaging design
    IEC 61188-5-4:2007 Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
    IPC 2581 : B GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY
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