1 SCOPE
1.1 Intent
1.2 Interpretation
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
3.1 Terms and Definitions
3.2 Categories and Content
4 GENERAL RULES
4.1 File Content Descriptions
4.2 Logistic Descriptions
4.3 File History Descriptions
4.3.1 HistoryRecord Use Case - Initial Design Release
4.3.2 Supply Chain Modifications
4.3.3 OEM Reviews Modifications
4.4 BOM (Board Fabrication Materials)
4.5 AVL (Board Material Suppliers)
4.6 Documentation Layers
4.6.1 Documentation Layer Restrictions
4.6.2 Reference to IPC-2614
4.6.3 Step Usage
4.6.4 Set
4.7 Design for eXcellence (Dfx) Analysis
4.7.1 DfxMeasurement
4.8 Miscellaneous Image Layers
4.8.1 Step usage
4.9 Packages and Land Patterns
4.9.1 Step Usage for Component Packages and Land
Patterns
4.9.2 Land Pattern Details
4.10 Solder Mask and Legend Layers
4.10.1 Solder Mask Details
4.10.2 Legend details
4.10.3 Step Usage for Solder Mask and Legend Layers
4.11 Drilling and Routing (Tooling) Layers
4.11.1 Drilling Details
4.11.2 Routing Details
4.11.3 Step Usage for Drilling and Routing
4.12 Net List
4.12.1 Step Usage for Net List
4.13 Outer Conductive Layers
4.13.1 Outer Conductive Layer Details
4.13.2 Step Usage for Outer Conductive Layers
4.14 Inner Conductive Layers
4.14.1 Inner Conductive Layer Details
4.14.2 Step Usage for Inner Conductive Layers
4.15 Board Construction
4.15.1 Board Construction Details
4.15.2 Step Usage for Board Construction
5 MODELING
5.1 Information Models
6 REPORT GENERATORS
6.1 Hole Usage Report
6.2 Pad Usage Report
6.3 Conductor Usage Report
7 REFERENCE INFORMATION
7.1 IPC
7.2 American National Standards Institute
7.3 Department of Defense
7.4 Electronic Industries Association
7.5 International Electrotechnical Commission (IEC)
7.6 International Organization for Standards (ISO)
APPENDIX A - PRINTED BOARD FABRICATION SCHEMA