IPC 3406 : 0
Current
The latest, up-to-date edition.
GUIDELINES FOR ELECTRICALLY CONDUCTIVE SURFACE MOUNT ADHESIVES
Hardcopy
English
01-07-1996
1.0 SCOPE
1.1 Introduction
2.0 APPLICABLE DOCUMENTS
2.1 IPC
3.0 BASIC TYPES AND FEATURES
3.1 Benefits and Limitations of Conductive
Adhesives
4.0 MATERIALS
4.1 Types of Polymers
4.2 Fillers
5.0 BASIC TYPES OF CONDUCTIVE ADHESIVES
5.1 Intrinsically Conductive Polymers (ICP)
5.2 Isotropically Conductive Adhesives
5.3 Anisotropic Conductive Adhesives
5.4 Nonconductive Adhesives Used for Electrical
Connections
6.0 APPLICATION AND ASSEMBLY PROCESS
6.1 Applying Isotropic Pastes
6.2 Applying Anisotropic Pastes
6.3 Applying Anisotropic Films
6.4 Component Placement
6.5 Hardening the Adhesive
6.6 Special Operations
7.0 REPAIR
7.1 Thermoplastic Systems
7.2 Thermosets
7.3 Anisotropics
8.0 PERFORMANCE
8.1 Mechanical
8.2 Electrical
8.3 Chemical
8.4 Compatibility
9.0 TESTING DIFFERENCES COMPARED TO SOLDER
9.1 Printability/Applicability
9.2 Hardening/Curing/Polymerization
9.3 Mechanical
9.4 Electrical
9.5 Inspection
Figures
Figure 3-1 Metallurgic solder (shown only as tin for
simplicity)
Figure 3-2 Electrical paths in isotropic conductive
adhesive
Figure 3-3 Isotropic conductive adhesive joint
Figure 3-4 Anisotropic conductive adhesives junctions
Figure 3-5 Result of evaluating conductive adhesive
using a screen designed for solder paste
Contains definitions for selecting electrically conductive adhesives (as alternatives to solder) for use in assembly of components to PCBs. Covers anisotropic types, thermosets, and thermoplastics.
DevelopmentNote |
Included in IPC C 103 & IPC C 1000. (07/2008)
|
DocumentType |
Standard
|
Pages |
66
|
PublisherName |
Institute of Printed Circuits
|
Status |
Current
|
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