IPC 3408 : 0

1.0 SCOPE
     1.1 Purpose
     1.2 Adhesive Classification
     1.3 Terms and Definitions
     1.4 Interpretation of Requirements 'Shall,'
2.0 APPLICABLE DOCUMENTS
     2.1 Institute for Interconnecting and Packaging
          Electronic Circuits (IPC)
     2.2 American Society for Testing and Materials
          (ASTM)
     2.3 Department of Defense (DoD)
     2.4 International Standards Organization
3.0 REQUIREMENTS
     3.1 General Requirements
     3.2 Application Process and Equipment
     3.3 Mechanical Requirements
     3.4 Electrical Requirements
     3.5 Chemical Requirements
     3.6 Rework
4.0 QUALITY ASSURANCE PROVISIONS
     4.1 Responsibility For Inspection
     4.2 Classification of Inspections
     4.3 Qualification Inspection
     4.4 Quality Conformance Inspection
5.0 NOTES
     5.1 Safety
     5.2 Cleanup
     5.3 Waste Disposal
     5.4 Packaging Material
     5.5 Marking and Labeling
     5.6 Shipment
     5.7 Storage
     5.8 Ordering Data
     5.9 Intended Use
Figures
Figure 3-1 Interconnection Resistance Test Assembly:
           Flex to ITO Glass
Tables
Table 4-1 Qualification Inspection
Table 4-2 Group A Inspections

Covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components and for their long-term properties as a part of the printed wiring board assembly.