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  • IPC CI 408 : 0

    Current The latest, up-to-date edition.

    DESIGN AND APPLICATION GUIDELINES FOR THE USE OF SOLDERLESS SURFACE MOUNT CONNECTORS

    Available format(s):  Hardcopy

    Language(s):  English

    Published date:  01-01-1994

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 INTRODUCTION
      1.1 Scope
      1.2 Purpose
      1.3 Terms, Definitions and Acronyms
      1.4 Applicable Documents
    2 TECHNOLOGIES SUMMARIZED
      2.1 Conductive Adhesives
      2.2 Elastomerics - Metal on Elastomer Type
      2.3 Layered Elastomeric Elements
      2.4 Elastomeric Conductive Polymer Interconnection
          (ECPI)
      2.5 Pressure Clip Interconnections
      2.6 Button Board
    3 TECHNOLOGIES EXPANDED
      3.1 Conductive Adhesives
      3.2 Elastomerics - Metal on Elastomer Type
      3.3 Layered Elastomeric Elements
      3.4 Elastomeric Conductive Polymer Interconnection (ECPI)
      3.5 Pressure Clip Interconnection
      3.6 Button Board
    Figures
    Tables

    Abstract - (Show below) - (Hide below)

    Covers design characteristics and the application of solderless surface mount connectors, including conductive adhesives in order to aid the designer in effectively interconnecting his package.

    General Product Information - (Show below) - (Hide below)

    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    IPC C 406 : 0 DESIGN AND APPLICATION GUIDELINES FOR SURFACE MOUNT CONNECTORS

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC E 500 : LATEST IPC ELECTRONIC DOCUMENT COLLECTION
    IPC 3408 : 0 GENERAL REQUIREMENTS FOR ANISOTROPICALLY CONDUCTIVE ADHESIVES FILMS
    IPC 3406 : 0 GUIDELINES FOR ELECTRICALLY CONDUCTIVE SURFACE MOUNT ADHESIVES
    IPC M 106 : LATEST TECHNOLOGY REFERENCE FOR DESIGN MANUAL
    IPC C 406 : 0 DESIGN AND APPLICATION GUIDELINES FOR SURFACE MOUNT CONNECTORS
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