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IPC 3406 : 0

Current

Current

The latest, up-to-date edition.

GUIDELINES FOR ELECTRICALLY CONDUCTIVE SURFACE MOUNT ADHESIVES

Available format(s)

PDF

Language(s)

English

Published date

01-07-1996

1.0 SCOPE
    1.1 Introduction
2.0 APPLICABLE DOCUMENTS
    2.1 IPC
3.0 BASIC TYPES AND FEATURES
    3.1 Benefits and Limitations of Conductive
        Adhesives
4.0 MATERIALS
    4.1 Types of Polymers
    4.2 Fillers
5.0 BASIC TYPES OF CONDUCTIVE ADHESIVES
    5.1 Intrinsically Conductive Polymers (ICP)
    5.2 Isotropically Conductive Adhesives
    5.3 Anisotropic Conductive Adhesives
    5.4 Nonconductive Adhesives Used for Electrical
        Connections
6.0 APPLICATION AND ASSEMBLY PROCESS
    6.1 Applying Isotropic Pastes
    6.2 Applying Anisotropic Pastes
    6.3 Applying Anisotropic Films
    6.4 Component Placement
    6.5 Hardening the Adhesive
    6.6 Special Operations
7.0 REPAIR
    7.1 Thermoplastic Systems
    7.2 Thermosets
    7.3 Anisotropics
8.0 PERFORMANCE
    8.1 Mechanical
    8.2 Electrical
    8.3 Chemical
    8.4 Compatibility
9.0 TESTING DIFFERENCES COMPARED TO SOLDER
    9.1 Printability/Applicability
    9.2 Hardening/Curing/Polymerization
    9.3 Mechanical
    9.4 Electrical
    9.5 Inspection
Figures
Figure 3-1 Metallurgic solder (shown only as tin for
           simplicity)
Figure 3-2 Electrical paths in isotropic conductive
           adhesive
Figure 3-3 Isotropic conductive adhesive joint
Figure 3-4 Anisotropic conductive adhesives junctions
Figure 3-5 Result of evaluating conductive adhesive
           using a screen designed for solder paste

This document covers guidelines for selecting electrically conductive adhesives for use in assembly of components to printed circuit boards (PCB) or similar wiring interconnect
systems.

DevelopmentNote
Included in IPC C 103 & IPC C 1000. (07/2008)
DocumentType
Standard
Pages
66
PublisherName
IPC by Global Electronics Association
Status
Current

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