IPC 3406 : 0
Current
The latest, up-to-date edition.
GUIDELINES FOR ELECTRICALLY CONDUCTIVE SURFACE MOUNT ADHESIVES
Hardcopy , PDF
English
01-07-1996
1.0 SCOPE
1.1 Introduction
2.0 APPLICABLE DOCUMENTS
2.1 IPC
3.0 BASIC TYPES AND FEATURES
3.1 Benefits and Limitations of Conductive
Adhesives
4.0 MATERIALS
4.1 Types of Polymers
4.2 Fillers
5.0 BASIC TYPES OF CONDUCTIVE ADHESIVES
5.1 Intrinsically Conductive Polymers (ICP)
5.2 Isotropically Conductive Adhesives
5.3 Anisotropic Conductive Adhesives
5.4 Nonconductive Adhesives Used for Electrical
Connections
6.0 APPLICATION AND ASSEMBLY PROCESS
6.1 Applying Isotropic Pastes
6.2 Applying Anisotropic Pastes
6.3 Applying Anisotropic Films
6.4 Component Placement
6.5 Hardening the Adhesive
6.6 Special Operations
7.0 REPAIR
7.1 Thermoplastic Systems
7.2 Thermosets
7.3 Anisotropics
8.0 PERFORMANCE
8.1 Mechanical
8.2 Electrical
8.3 Chemical
8.4 Compatibility
9.0 TESTING DIFFERENCES COMPARED TO SOLDER
9.1 Printability/Applicability
9.2 Hardening/Curing/Polymerization
9.3 Mechanical
9.4 Electrical
9.5 Inspection
Figures
Figure 3-1 Metallurgic solder (shown only as tin for
simplicity)
Figure 3-2 Electrical paths in isotropic conductive
adhesive
Figure 3-3 Isotropic conductive adhesive joint
Figure 3-4 Anisotropic conductive adhesives junctions
Figure 3-5 Result of evaluating conductive adhesive
using a screen designed for solder paste
This document covers guidelines for selecting electrically conductive adhesives for use in assembly of components to printed circuit boards (PCB) or similar wiring interconnect
systems.
| DevelopmentNote |
Included in IPC C 103 & IPC C 1000. (07/2008)
|
| DocumentType |
Standard
|
| Pages |
66
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Current
|
| BS EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies |
| EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| IPC 7526 : 2007 | STENCIL AND MISPRINTED BOARD CLEANING HANDBOOK |
| IPC 3408 : 0 | GENERAL REQUIREMENTS FOR ANISOTROPICALLY CONDUCTIVE ADHESIVES FILMS |
| IEC 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| IPC 3408 : 0 | GENERAL REQUIREMENTS FOR ANISOTROPICALLY CONDUCTIVE ADHESIVES FILMS |