• IPC 3406 : 0

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    GUIDELINES FOR ELECTRICALLY CONDUCTIVE SURFACE MOUNT ADHESIVES

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    Published date:  01-07-1996

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1.0 SCOPE
        1.1 Introduction
    2.0 APPLICABLE DOCUMENTS
        2.1 IPC
    3.0 BASIC TYPES AND FEATURES
        3.1 Benefits and Limitations of Conductive
            Adhesives
    4.0 MATERIALS
        4.1 Types of Polymers
        4.2 Fillers
    5.0 BASIC TYPES OF CONDUCTIVE ADHESIVES
        5.1 Intrinsically Conductive Polymers (ICP)
        5.2 Isotropically Conductive Adhesives
        5.3 Anisotropic Conductive Adhesives
        5.4 Nonconductive Adhesives Used for Electrical
            Connections
    6.0 APPLICATION AND ASSEMBLY PROCESS
        6.1 Applying Isotropic Pastes
        6.2 Applying Anisotropic Pastes
        6.3 Applying Anisotropic Films
        6.4 Component Placement
        6.5 Hardening the Adhesive
        6.6 Special Operations
    7.0 REPAIR
        7.1 Thermoplastic Systems
        7.2 Thermosets
        7.3 Anisotropics
    8.0 PERFORMANCE
        8.1 Mechanical
        8.2 Electrical
        8.3 Chemical
        8.4 Compatibility
    9.0 TESTING DIFFERENCES COMPARED TO SOLDER
        9.1 Printability/Applicability
        9.2 Hardening/Curing/Polymerization
        9.3 Mechanical
        9.4 Electrical
        9.5 Inspection
    Figures
    Figure 3-1 Metallurgic solder (shown only as tin for
               simplicity)
    Figure 3-2 Electrical paths in isotropic conductive
               adhesive
    Figure 3-3 Isotropic conductive adhesive joint
    Figure 3-4 Anisotropic conductive adhesives junctions
    Figure 3-5 Result of evaluating conductive adhesive
               using a screen designed for solder paste

    Abstract - (Show below) - (Hide below)

    Contains definitions for selecting electrically conductive adhesives (as alternatives to solder) for use in assembly of components to PCBs. Covers anisotropic types, thermosets, and thermoplastics.

    General Product Information - (Show below) - (Hide below)

    Development Note Included in IPC C 103 & IPC C 1000. (07/2008)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
    EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
    IPC CA 821 : 0 GENERAL REQUIREMENTS FOR THERMALLY CONDUCTIVE ADHESIVES
    IPC 7526 : 2007 STENCIL AND MISPRINTED BOARD CLEANING HANDBOOK
    IPC CI 408 : 0 DESIGN AND APPLICATION GUIDELINES FOR THE USE OF SOLDERLESS SURFACE MOUNT CONNECTORS
    IPC 3408 : 0 GENERAL REQUIREMENTS FOR ANISOTROPICALLY CONDUCTIVE ADHESIVES FILMS
    IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC CA 821 : 0 GENERAL REQUIREMENTS FOR THERMALLY CONDUCTIVE ADHESIVES
    IPC S 100 : LATEST STANDARDS AND SPECIFICATIONS MANUAL
    IPC 3408 : 0 GENERAL REQUIREMENTS FOR ANISOTROPICALLY CONDUCTIVE ADHESIVES FILMS
    IPC SM 817 : A GENERAL REQUIREMENTS FOR DIELECTRIC SURFACE MOUNTING ADHESIVES
    IPC M 103 : LATEST STANDARDS FOR SURFACE MOUNT ASSEMBLIES MANUAL
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