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IPC 4121 : 0

Current

Current

The latest, up-to-date edition.

GUIDELINES FOR SELECTING CORE CONSTRUCTIONS FOR MULTILAYER PRINTED WIRING BOARD APPLICATIONS

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2000

1 SCOPE
  1.1 Purpose
  1.2 Recommendations
  1.3 Clarifications
2 APPLICABLE DOCUMENTS
  2.1 IPC
3 TERMS AND DEFINITIONS
  3.1 Registration Number (REG#)
  3.2 Thickness
  3.3 Construction
  3.4 Resin Content (% RC)
  3.5 Dielectric Constant (DK)
  3.6 Dielectric Constant Tolerances (DK TOL)
  3.7 Dimensional Stability
  3.8 Coefficient of Thermal Expansion (Z-CTE)
  3.9 Thickness Tolerance (THICK TOL)
  3.10 Chemical Resistance (CHEM)
  3.11 Measling (MEASLE)
  3.12 Availability (AVAIL)
  3.13 Cost
  3.14 Flatness (FLAT)
  3.15 Smoothness (SMOOTH)
  3.16 Drillability (DRILL)
4 RECOMMENDATIONS
  4.1 Thickness Categories
  4.2 Construction Comparison

Provides industry-approved guidelines for selecting core constructions for multilayer printed wiring boards (PWBs). The specification sheets in the document categorize the different core constructions by laminate type and nominal thickness. The constructions are rated for characteristics such as dielectric constant (DK), dimensional stability (DS), flatness, smoothness and drillability.

DevelopmentNote
Supersedes IPC CC 110. (07/2001) Included in IPC C 107 & IPC C 1000. (07/2008)
DocumentType
Standard
Pages
21
PublisherName
IPC by Global Electronics Association
Status
Current

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