IPC 4121 : 0

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Current The latest, up-to-date edition.

GUIDELINES FOR SELECTING CORE CONSTRUCTIONS FOR MULTILAYER PRINTED WIRING BOARD APPLICATIONS

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Published date: 01-01-2000

Publisher: Institute of Printed Circuits

Table of Contents - (Show below) - (Hide below)

1 SCOPE
  1.1 Purpose
  1.2 Recommendations
  1.3 Clarifications
2 APPLICABLE DOCUMENTS
  2.1 IPC
3 TERMS AND DEFINITIONS
  3.1 Registration Number (REG#)
  3.2 Thickness
  3.3 Construction
  3.4 Resin Content (% RC)
  3.5 Dielectric Constant (DK)
  3.6 Dielectric Constant Tolerances (DK TOL)
  3.7 Dimensional Stability
  3.8 Coefficient of Thermal Expansion (Z-CTE)
  3.9 Thickness Tolerance (THICK TOL)
  3.10 Chemical Resistance (CHEM)
  3.11 Measling (MEASLE)
  3.12 Availability (AVAIL)
  3.13 Cost
  3.14 Flatness (FLAT)
  3.15 Smoothness (SMOOTH)
  3.16 Drillability (DRILL)
4 RECOMMENDATIONS
  4.1 Thickness Categories
  4.2 Construction Comparison

Abstract - (Show below) - (Hide below)

Provides industry-approved guidelines for selecting core constructions for multilayer printed wiring boards (PWBs). The specification sheets in the document categorize the different core constructions by laminate type and nominal thickness. The constructions are rated for characteristics such as dielectric constant (DK), dimensional stability (DS), flatness, smoothness and drillability.

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Development Note	Supersedes IPC CC 110. (07/2001) Included in IPC C 107 & IPC C 1000. (07/2008)
Document Type	Standard
ISBN
Pages
Published
Publisher	Institute of Printed Circuits
Status	Current
Supersedes	IPC CC 110 : A 1997

Standards Referenced By This Book - (Show below) - (Hide below)

IPC 4101 CHINESE : C2009	SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
IPC 4101 GERMAN : C	SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
BS EN 16602-70-12:2016	Space product assurance. Design rules for printed circuit boards
EN 16602-70-12:2016	Space product assurance - Design rules for printed circuit boards
IPC TA 721 : 1988	TECHNOLOGY ASSESSMENT HANDBOOK ON MULTILAYER BOARDS

Standards Referencing This Book - (Show below) - (Hide below)

IPC 2220 : LATEST	IPC 2220 FAMILY OF DESIGN DOCUMENTS
IPC M 107 : LATEST	STANDARDS FOR PRINTED BOARD MATERIALS MANUAL
IPC M 106 : LATEST	TECHNOLOGY REFERENCE FOR DESIGN MANUAL

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