• IPC 2220 : LATEST

    Current The latest, up-to-date edition.

    IPC 2220 FAMILY OF DESIGN DOCUMENTS

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    Published date:  23-11-2012

    Publisher:  Institute of Printed Circuits

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    Abstract - (Show below) - (Hide below)

    Provides coverage on material and final finish selection, current carrying capacity and minimum electrical clearances, test specimen design, guidelines for V-groove scoring, dimensioning requirements and conductor thickness requirements.

    General Product Information - (Show below) - (Hide below)

    Development Note Includes IPC 2221 KIT, IPC 2222, IPC 2223, IPC 2224, IPC 2225 & IPC 2226. (03/2002) Also available in CD-ROM format. (05/2016)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    DSCC 11001 : 0 PRINTED WIRING BOARD, FLEXIBLE, TYPE 1 (SINGLE-SIDED ) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER
    IPC D 325 : A DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS
    IPC 4121 : 0 GUIDELINES FOR SELECTING CORE CONSTRUCTIONS FOR MULTILAYER PRINTED WIRING BOARD APPLICATIONS
    IPC TR 551 : 1993 QUALITY ASSESSMENT OF PRINTED BOARDS USED FOR MOUNTING AND INTERCONNECTING ELECTRONIC COMPONENTS
    IPC TR 579 : 0 ROUND ROBIN RELIABILITY EVALUATION OF SMALL DIAMETER PLATED-THROUGH HOLES IN PWBS
    DSCC 11004 : 0 PRINTED WIRING BOARD, RIGID FLEX, TYPE 4 (MULTILAYERED) WITH SUPPORTED HOLES, WITH STIFFENER
    J STD 026 : 0 SEMICONDUCTOR DESIGN STANDARD FOR FLIP CHIP APPLICATIONS
    J STD 028 : 0 PERFORMANCE STANDARD FOR CONSTRUCTION OF FLIP CHIP AND CHIP SCALE BUMPS
    IPC 2615 : 0 PRINTED BOARD DIMENSIONS AND TOLERANCES
    IPC TR 578 : 1984 LEADING EDGE MANUFACTURING TECHNOLOGY REPORT
    DSCC 11003 : 0 PRINTED WIRING BOARD, FLEXIBLE, TYPE 3 (MULTILAYER) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER
    DSCC 11002 : 0 PRINTED WIRING BOARD, FLEXIBLE, TYPE 2 (DOUBLE-SIDED) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER
    DSCC 11005 : 0 PRINTED WIRING BOARD, RIGID FLEX, TYPE 5 (MULTILAYER) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER
    IPC D 322 : 0 GUIDELINES FOR SELECTING PRINTED WIRING BOARD SIZES USING STANDARD PANEL SIZES
    IPC MC 790 : 0 GUIDELINES FOR MULTICHIP MODULE TECHNOLOGY UTILIZATION
    IPC 6015 : 0 QUALIFICATION AND PERFORMANCE SPECIFICATION FOR ORGANIC MULTICHIP MODULE MOUNTING AND INTERCONNECTING STRUCTURES
    IPC HDI 1 : LATEST HIGH DENSITY INTERCONNECT MICROVIA TECHNOLOGY COMPENDIUM
    PD IEC/PAS 61182-12:2014 Generic requirements for printed board assembly products manufacturing description data and transfer methodology
    IEC PAS 61182-12:2014 Generic requirements for printed board assembly products manufacturing description data and transfer methodology
    IEC 61182-2:2006 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements
    BS EN 50155:2017 RAILWAY APPLICATIONS - ROLLING STOCK - ELECTRONIC EQUIPMENT
    BS IEC 61182-2:2006 PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2: GENERIC REQUIREMENTS
    EN 50155:2017 RAILWAY APPLICATIONS - ROLLING STOCK - ELECTRONIC EQUIPMENT
    I.S. EN 50155:2017-11 RAILWAY APPLICATIONS - ROLLING STOCK - ELECTRONIC EQUIPMENT
    IPC 2581 : B GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY
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