IPC 6017 : 0

1 SCOPE
  1.1 Statement of Scope
  1.2 Purpose
  1.3 Performance Classification
  1.4 Embedded Passive Device Categories
  1.5 Documentation Hierarchy
  1.6 Selection for Procurement
  1.7 Selection (Default)
  1.8 Terms and Definitions
      1.8.1 As Agreed Upon Between User and Supplier
            (AABUS)
2 APPLICABLE DOCUMENTS
  2.1 IPC
  2.2 Underwriters Laboratories
3 REQUIREMENTS
  3.1 General
  3.2 Materials
      3.2.1 Rigid Laminates
      3.2.2 Flexible Films
      3.2.3 Microwave High Speed Materials
      3.2.4 Bonding Materials
      3.2.5 Resistor Materials
      3.2.6 Capacitor and Capacitance Materials
      3.2.7 Metal Foils
      3.2.8 Metallic Plating and Coatings
      3.2.9 Solder Mask
      3.2.10 Polymer Coatings for Embedded Passive Devices
      3.2.11 Marking Inks
      3.2.12 Other Materials
  3.3 Visual Examination
  3.4 PB Dimensional Requirements
  3.5 Embedded Passive Pattern Definition
      3.5.1 Size Verification
      3.5.2 Spacing
      3.5.3 Conductive Surfaces
       3.5.4 Nicks and Pinholes
  3.6 Structural Integrity
       3.6.1 Thermal Stress
       3.6.2 Microsection Integrity
  3.7 Protective Coverage
       3.7.1 Solder Mask Coverage Requirements
       3.7.2 Other Protective Coatings
  3.8 Electrical Requirements
       3.8.1 Electrical Requirements of Embedded
             Passives Devices in PBs
       3.8.2 Dielectric Withstanding Voltage
       3.8.3 Circuitry
       3.8.4 Moisture and Insulation Resistance (MIR)
  3.9 Cleanliness
  3.10 Special Requirements
       3.10.1 Heat Dissipation
       3.10.2 Thermal Shock
  3.11 Repair
4 QUALITY ASSURANCE PROVISIONS
  4.1 General
  4.2 Acceptance Tests
       4.2.1 C=0 Zero Acceptance Number Sampling Plan
       4.2.2 Referee Tests

Specifies qualification and performance of in-process and finished printed boards (PBs) containing embedded passive circuitry with distributive capacitive planes, capacitive or resistive components.