• IPC D 325 : A

    Current The latest, up-to-date edition.

    DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS

    Available format(s):  Hardcopy

    Language(s):  English

    Published date: 

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1.0 Scope
    1.1 Purpose
    1.2 Classification
    1.3 Interpretation 'shall'
    1.4 Documentation Media
    1.5 Artwork - Generation
    1.6 Presentation
    1.7 Conflict - military application
    1.8 Order of precedence
    2.0 Applicable Documents
    2.1 IPC
    2.2 Department of Defense
    2.3 Other documents
    3.0 Requirements
    3.1 Terms and Definitions
    3.2 Drawing sizes and format
    3.3 Title block
    3.4 Titles and subtitles
    3.5 Sign-off column
    3.6 Multiple sheets
    3.7 Master drawing number/bare board part number
    3.8 Preliminary release
    3.9 Initial release
    3.10 Master drawing revision level/bare board revision
          level
    3.11 Approvals block
    3.12 Revision letters
    3.13 Temporary revision (optional)
    3.14 Updated and/or redrawn drawings
    3.15 Contract number
    3.16 Application block (optional)
    3.17 Commercial and government entity (cage code)
    3.18 Distribution key (optional)
    3.19 Material block (optional)
    3.20 Configuration control
    3.21 Numbering of notes
    4.0 Documentation package
    4.1 Documentation and electronic data
    4.2 Master Drawing
    4.3 Marking
    4.4 Grid systems
    5.0 Sample figures and examples
    6.0 Master drawing notes and check list
    6.1 Examples of typical notes:
    6.2 Master drawing check list
    7.0 Design outputs
    7.1 Design verification
    7.2 Final documentation package
    7.3 CAD system outputs
    7.4 Data transfer
    7.5 Readme file
    8.0 Printed board assembly drawings
    8.1 Assembly drawing definition
    8.2 Dash/group numbers
    8.3 Printed board assembly drawing requirements
    8.4 Special assembly drawing notes
    8.5 Parts list (PL) definition
    8.6 Separate parts list
    8.7 Integral parts list
    8.8 Item (find) number
    8.9 Electrical component cross reference listing
    8.10 Revision level control (RLC) chart (optional)
    8.11 Spare component locations chart (optional)
    8.12 Cover sheets (optional)
    8.13 Parts information
    8.14 Non-standard part information
    8.15 Manufacturing tools charts (optional)
    8.16 Electrostatic sensitive deviced (ESD)
    8.17 Quality conformance coupons
    9.0 Printed board support drawings
    9.1 Fixtures
    10.0 Schematic/logic diagrams
    10.1 Scope
    10.2 Definition schematic diagram
    10.3 Referenced standards
    10.4 Format
    10.5 Line styles and lettering
    10.6 Graphic symbols and cell libraries
    10.7 Abbreviations and acronyms
    10.8 Layout
    10.9 Connecting lines
    10.10 Junctions
    10.11 Terminals
    10.12 Wire leads
    10.13 Interrupted paths
    10.14 Mechanical linkages
    10.15 Connectors
    10.16 Numerical values
    10.17 Multi-element symbols
    10.18 Functions
    10.19 Reference designations
    10.20 Type designations
    10.21 Unused pins
    10.22 Spares
    10.23 Gnd and power table
    10.24 Notes on schematics
    10.25 Schematic/logic diagram
    10.26 Final schematic/logic

    Abstract - (Show below) - (Hide below)

    Provides general requirements for documentation necessary to fully describe end product printed boards, regardless of raw material, special fabrication requirements, layer count or end product usage. Includes master drawing requirements, board definition and artwork/photo tooling.

    General Product Information - (Show below) - (Hide below)

    Development Note Supersedes IPC ML 975. (03/2002) Included in IPC C 106. (06/2008) Included in IPC C 105 & IPC C 1000. (07/2008)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    DSCC 11001 : 0 PRINTED WIRING BOARD, FLEXIBLE, TYPE 1 (SINGLE-SIDED ) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER
    BS EN 61182-2-2 : 2012 PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION
    BS EN 61182-7:1996 PRINTED BOARDS - ELECTRONIC DATA DESCRIPTION AND TRANSFER - BARE BOARD ELECTRIC TEST INFORMATION IN DIGITAL FORM
    DSCC 11002 : 0 PRINTED WIRING BOARD, FLEXIBLE, TYPE 2 (DOUBLE-SIDED) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER
    DSCC 11004 : 0 PRINTED WIRING BOARD, RIGID FLEX, TYPE 4 (MULTILAYERED) WITH SUPPORTED HOLES, WITH STIFFENER
    I.S. EN 61182-2-2:2012 PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION (IEC 61182-2-2:2012 (EQV))
    IPC 2615 : 0 PRINTED BOARD DIMENSIONS AND TOLERANCES
    ASME Y14.100M : 1998 ENGINEERING DRAWING PRACTICES
    DSCC 11003 : 0 PRINTED WIRING BOARD, FLEXIBLE, TYPE 3 (MULTILAYER) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER
    IPC D 356 : B BARE SUBSTRATE ELECTRICAL TEST DATA FORMAT
    IPC 6017 : 0 QUALIFICATION AND PERFORMANCE SPECIFICATION FOR PRINTED BOARDS CONTAINING EMBEDDED PASSIVE DEVICES
    ASME Y14.100 : 2017 ENGINEERING DRAWING PRACTICES - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES
    DSCC 11005 : 0 PRINTED WIRING BOARD, RIGID FLEX, TYPE 5 (MULTILAYER) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER
    I.S. EN 61182-7:1998 PRINTED BOARDS - ELECTRONIC DATA DESCRIPTION AND TRANSFER - PART 7: BARE BOARD ELECTRIC TEST INFORMATION IN DIGITAL FORM
    IEC 61182-1:1994 Printed boards - Electronic data description and transfer - Part 1: Printed board description in digital form
    PD IEC/PAS 61182-12:2014 Generic requirements for printed board assembly products manufacturing description data and transfer methodology
    IEC PAS 61182-12:2014 Generic requirements for printed board assembly products manufacturing description data and transfer methodology
    IEC 61182-2:2006 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements
    IEC PAS 62250:2001 Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1)
    IEC 61182-2-2:2012 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
    IEC PAS 62249:2001 Qualification and performance specification for flexible printed boards
    IEC 61182-7:1995 Printed boards - Electronic data description and transfer - Part 7: Bare board electrical test information in digital form
    BS IEC 61182-2:2006 PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2: GENERIC REQUIREMENTS
    ASME Y14.24 : 2012 TYPES AND APPLICATIONS OF ENGINEERING DRAWINGS - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES
    IPC 2581 : B GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY
    EN 61182-2-2 : 2012 PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION (IEC 61182-2-2:2012)
    EN 61182-7 : 1995 PRINTED BOARDS - ELECTRONIC DATA DESCRIPTION AND TRANSFER - PART 7: BARE BOARD ELECTRIC TEST INFORMATION IN DIGITAL FORM

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC 2220 : LATEST IPC 2220 FAMILY OF DESIGN DOCUMENTS
    IPC D 326 : A INFORMATION REQUIREMENTS FOR MANUFACTURING PRINTED CIRCUIT BOARDS AND OTHER ELECTRONIC ASSEMBLIES
    IPC S 100 : LATEST STANDARDS AND SPECIFICATIONS MANUAL
    IPC 2615 : 0 PRINTED BOARD DIMENSIONS AND TOLERANCES
    IPC M 105 : LATEST RIGID PRINTED BOARD MANUAL
    IPC M 106 : LATEST TECHNOLOGY REFERENCE FOR DESIGN MANUAL
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