DSCC 11001 : 0
|
PRINTED WIRING BOARD, FLEXIBLE, TYPE 1 (SINGLE-SIDED ) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER |
BS EN 61182-2-2 : 2012
|
PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION |
DSCC 11004 : 0
|
PRINTED WIRING BOARD, RIGID FLEX, TYPE 4 (MULTILAYERED) WITH SUPPORTED HOLES, WITH STIFFENER |
IPC 6017 : 0
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR PRINTED BOARDS CONTAINING EMBEDDED PASSIVE DEVICES |
DSCC 11005 : 0
|
PRINTED WIRING BOARD, RIGID FLEX, TYPE 5 (MULTILAYER) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER |
PD IEC/PAS 61182-12:2014
|
Generic requirements for printed board assembly products manufacturing description data and transfer methodology |
IEC 61182-2:2006
|
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements |
IEC PAS 62250:2001
|
Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1) |
EN 61182-2-2 : 2012
|
PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION (IEC 61182-2-2:2012) |
DSCC 11002 : 0
|
PRINTED WIRING BOARD, FLEXIBLE, TYPE 2 (DOUBLE-SIDED) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER |
IPC 2615 : 0
|
PRINTED BOARD DIMENSIONS AND TOLERANCES |
IPC D 356 : B
|
BARE SUBSTRATE ELECTRICAL TEST DATA FORMAT |
IEC 61182-1:1994
|
Printed boards - Electronic data description and transfer - Part 1: Printed board description in digital form |
IPC 2581 : B
|
GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY |
IEC PAS 61182-12:2014
|
Generic requirements for printed board assembly products manufacturing description data and transfer methodology |
DSCC 11003 : 0
|
PRINTED WIRING BOARD, FLEXIBLE, TYPE 3 (MULTILAYER) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER |
I.S. EN 61182-7:1998
|
PRINTED BOARDS - ELECTRONIC DATA DESCRIPTION AND TRANSFER - PART 7: BARE BOARD ELECTRIC TEST INFORMATION IN DIGITAL FORM |
IEC 61182-2-2:2012
|
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description |
IEC PAS 62249:2001
|
Qualification and performance specification for flexible printed boards |
IEC 61182-7:1995
|
Printed boards - Electronic data description and transfer - Part 7: Bare board electrical test information in digital form |
BS IEC 61182-2:2006
|
PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2: GENERIC REQUIREMENTS |
EN 61182-7 : 1995
|
PRINTED BOARDS - ELECTRONIC DATA DESCRIPTION AND TRANSFER - PART 7: BARE BOARD ELECTRIC TEST INFORMATION IN DIGITAL FORM |
BS EN 61182-7:1996
|
PRINTED BOARDS - ELECTRONIC DATA DESCRIPTION AND TRANSFER - BARE BOARD ELECTRIC TEST INFORMATION IN DIGITAL FORM |
I.S. EN 61182-2-2:2012
|
PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION (IEC 61182-2-2:2012 (EQV)) |