IPC 7912 : A

1 OVERVIEW
   1.1 Scope
   1.2 Purpose
   1.3 Terms and Definitions
2 APPLICABLE DOCUMENTS
3 CATEGORIZATION OF OPPORTUNITIES AND DEFECTS
   3.1 Component Opportunities (oc)
   3.2 Component Defect (dc)
   3.3 Placement Opportunity (op)
   3.4 Placement Defect (dp)
   3.5 Termination Opportunity (ot)
   3.6 Termination Defect (dt)
   3.7 Listing of Countable Defects
4 CALCULATION OF INDICES
   4.1 DPMO Index
   4.2 OMI
   4.3 Remarks
APPENDIX A
APPENDIX B
Figures
Figure 4-1 Calculations for Completed Electronic
           Assemblies: Conceptual Diagram
Figure A-1 Example One
Figure A-2 Example Two
Tables
Table A-1 Example One
Table A-2 Example Two
Table B-1 Component Defects
Table B-2 Placement Defects
Table B-3 Termination Defects

Provides consistent methodologies for calculating benchmark indices for DPMO Index, Component DPMO, Placement DPMO, Termination DPMO, and Overall Manufacturing Index (OMI). This document is for end-of-process benchmarking and it provides a definitive roadmap on 'how' to arrive at the industry's most relevant DPMO related indices.