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  • IPC A 610 : F

    View superseded by
    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    ACCEPTABILITY OF ELECTRONIC ASSEMBLIES

    Available format(s):  Hardcopy

    Superseded date:  11-04-2019

    Language(s):  English

    Published date: 

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 General
    2 Applicable Documents
    3 Handling Electronic Assemblies
    4 Hardware
    5 Soldering
    6 Terminal Connections
    7 Through-Hole Technology
    8 Surface Mount Assemblies
    9 Component Damage
    10 Printed Circuit Boards and
       Assemblies
    11 Discrete Wiring
    12 High Voltage
    Appendix A - Minimum Electrical
                 Clearance - Electrical
                 Conductor Spacing
    Index

    Abstract - (Show below) - (Hide below)

    Describes acceptance requirements for the manufacture of electrical and electronic assemblies.

    General Product Information - (Show below) - (Hide below)

    Committee 7-30
    Development Note Included in IPC C 1036 & IPC C 1000. D2005 Edition is still available in Finnish Language, See separate record. E2010 Edition is still available in Hindi, Czech, Italian, Turkish & Estonian Languages, See separate records. F2014 Edition is still available in German, Japanese, Swedish, Polish, Dutch, Chinese, Danish, Hebrew, Hungarian, Korean, Romanian, Vietnamese, Spanish & Russian Languages, See separate records. (08/2016) Also available in Hardcopy format. (01/2018)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Superseded
    Superseded By

    Standards Referenced By This Book - (Show below) - (Hide below)

    DEFSTAN 08-107/3(2013) : 2013 GENERAL REQUIREMENTS FOR THE DESIGN OF ELECTROTECHNICAL AND NAVAL WEAPON EQUIPMENT
    I.S. EN 61191-2:2017 PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
    BS EN 61191-3:2017 Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
    BS EN 61189-5-1:2016 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - GUIDANCE FOR PRINTED BOARD ASSEMBLIES
    IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
    BS EN 50155:2017 Railway applications. Rolling stock. Electronic equipment
    BS EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
    16/30282633 DC : 0 BS EN 50155 - RAILWAY APPLICATIONS - ELECTRONIC EQUIPMENT USED ON ROLLING STOCK
    EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
    I.S. EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV))
    CSA N290.8 : 2015 TECHNICAL SPECIFICATION REQUIREMENTS FOR NUCLEAR POWER PLANT COMPONENTS
    MIL STD 2000 : A STANDARD REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    J STD 032 : 0 PERFORMANCE STANDARD FOR BALL GRID ARRAY BALLS
    IPC 7095 : C DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
    PD CLC/TR 50506-2:2009 Railway applications. Communication, signalling and processing systems. Application guide for EN 50129 Safety assurance
    17/30352677 DC : 0 BS IEC 61188-6-4 ED1.0 - PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 6-4: GENERIC REQUIREMENTS FOR DIMENSIONAL DRAWINGS OF SMDS FROM VIEWPOINT OF LAND-PATTERN DESIGN
    15/30328104 DC : DRAFT JULY 2015 BS EN 61191-2 - PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
    11/30255128 DC : 0 BS EN 61191-2 - PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
    PD IEC/TS 62647-1:2012 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan
    IEC PAS 62647-23:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
    IPC 7351 : B GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
    IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    I.S. EN 50155:2017-11 RAILWAY APPLICATIONS - ROLLING STOCK - ELECTRONIC EQUIPMENT
    I.S. EN 61191-4:2017 PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
    J STD 001 CHINESE : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    I.S. EN 61191-3:2017 PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
    J STD 001 SPANISH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    J STD 001 FRENCH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC WHMA A 620 DANISH : B REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
    IPC 7093 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
    IPC 7527 DANISH : - REQUIREMENTS FOR SOLDER PASTE PRINTING
    CLC/TR 50506-2 : 2009 RAILWAY APPLICATIONS - COMMUNICATION, SIGNALLING AND PROCESSING SYSTEMS - APPLICATION GUIDE FOR EN 50129 - PART 2: SAFETY ASSURANCE
    IPC 7527 GERMAN : - REQUIREMENTS FOR SOLDER PASTE PRINTING
    IPC A 630 CHINESE : - ACCEPTABILITY STANDARD FOR MANUFACTURE, INSPECTION AND TESTING OF ELECTRONIC ENCLOSURES
    SAE AS 12500 : 2018 CORROSION PREVENTION AND DETERIORATION CONTROL IN ELECTRONIC COMPONENTS AND ASSEMBLIES
    ARINC 669 : 2004 GUIDANCE FOR LEAD-BASED SOLDERING, REPAIR AND REWORK
    GEIA HB 0005-3 : 2008 REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
    GEIA HB 0005-2 : 2007 TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
    IEEE 1662-2008 DESIGN AND APPLICATION OF POWER ELECTRONICS IN ELECTRICAL POWER SYSTEMS
    BS EN 61191-4:2017 Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies
    GEIA STD 0005-1 : 2012 PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
    EN 50155:2017 Railway applications - Rolling stock - Electronic equipment
    CSA N290.14 : 2015 QUALIFICATION OF DIGITAL HARDWARE AND SOFTWARE FOR USE IN INSTRUMENTATION AND CONTROL APPLICATIONS FOR NUCLEAR POWER PLANTS
    IPC HDBK 630 : 0 GUIDELINES FOR DESIGN, MANUFACTURE, INSPECTION AND TESTING OF ELECTRONIC ENCLOSURES ASSEMBLY
    IEC TS 62647-1:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
    IES RP 7 : 2017 RECOMMENDED PRACTICE FOR LIGHTING INDUSTRIAL FACILITIES
    CEI CLC/TR 50506-2 : 2011 RAILWAY APPLICATIONS - COMMUNICATION, SIGNALLING AND PROCESSING SYSTEMS - APPLICATION GUIDE FOR EN 50129 - PART 2: SAFETY ASSURANCE
    SAE USCAR 33 : 2013 SPECIFICATION FOR TESTING AUTOMOTIVE LED MODULES
    IPC 9262 : 2016 SPECIFICATION FOR CHARACTERIZATION AND VERIFICATION OF ASSEMBLY LEVEL AUTOMATIC OPTICAL INSPECTION EQUIPMENT
    IPC BP 421 : 80(R1990) GENERAL SPECIFICATION FOR RIGID PRINTED BOARD BACKPLANES WITH PRESS-FIT CONTACTS
    IPC A 630 : 0 ACCEPTABILITY STANDARD FOR MANUFACTURE, INSPECTION AND TESTING OF ELECTRONIC ENCLOSURES
    API TR 18TR4 : 2017 EVALUATION OF WELDING REQUIREMENTS AS APPLICABLE TO API PRODUCT SPECIFICATIONS
    NFPA 1917 : 2016 AUTOMOTIVE AMBULANCES
    S.R. CLC/TR 50506-2:2009 RAILWAY APPLICATIONS - COMMUNICATION, SIGNALLING AND PROCESSING SYSTEMS - APPLICATION GUIDE FOR EN 50129 - PART 2: SAFETY ASSURANCE
    ARINC 671 : 2006 GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR
    IEC PAS 62647-21:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics
    IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    IEC TS 62647-23:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
    PD IEC/TS 62647-23:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
    IEC PAS 62647-1:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management
    15/30327712 DC : 0 BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
    BS EN 61191-2:2017 PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017)
    PD IEC/PAS 62647-1:2011 PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 1: LEAD-FREE MANAGEMENT
    IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
    11/30255124 DC : 0 BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
    IEC TS 62647-22:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
    IEC PAS 62647-22:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
    DD IEC PAS 62647-23 : DRAFT AUG 2011 PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES
    IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
    IPC 7527 : 0 REQUIREMENTS FOR SOLDER PASTE PRINTING
    IPC DVD LFL : LATEST IMAGE LIBRARY: LEAD FREE SOLDER JOINTS
    IPC 7094 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR FLIP CHIP AND DIE SIZE COMPONENTS
    EN 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    PD IEC/TS 62647-22:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines
    EN 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
    EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
    EN 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
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