IPC A 610 : F
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
Amended by
Available format(s)
PDF
Language(s)
French, Hungarian, Vietnamese, Danish, German, Swedish, Spanish, Castilian, Romanian, Moldavian, Moldovan, Japanese
Published date
28-08-2014
Publisher
Superseded date
12-04-2019
Superseded by
Excluding VAT
1 General
2 Applicable Documents
3 Handling Electronic Assemblies
4 Hardware
5 Soldering
6 Terminal Connections
7 Through-Hole Technology
8 Surface Mount Assemblies
9 Component Damage
10 Printed Circuit Boards and
Assemblies
11 Discrete Wiring
12 High Voltage
Appendix A - Minimum Electrical
Clearance - Electrical
Conductor Spacing
Index
Describes acceptance requirements for the manufacture of electrical and electronic assemblies.
| Committee |
7-30
|
| DevelopmentNote |
Included in IPC C 1036 & IPC C 1000. D2005 Edition is still available in Finnish Language, See separate record. E2010 Edition is still available in Hindi, Czech, Italian, Turkish & Estonian Languages, See separate records. F2014 Edition is still available in German, Japanese, Swedish, Polish, Dutch, Chinese, Danish, Hebrew, Hungarian, Korean, Romanian, Vietnamese, Spanish & Russian Languages, See separate records. (08/2016) Also available in Hardcopy format. (01/2018)
|
| DocumentType |
Standard
|
| Pages |
424
|
| ProductNote |
New child AMD 1 2015 is now added New child ADD 2017 is now added New child AMD 2 2016 is now added
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| DEFSTAN 08-107/3(2013) : 2013 | GENERAL REQUIREMENTS FOR THE DESIGN OF ELECTROTECHNICAL AND NAVAL WEAPON EQUIPMENT |
| I.S. EN 61191-2:2017 | PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES |
| BS EN 61191-3:2017 | Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies |
| BS EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies |
| IEC 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| BS EN 50155:2017 | Railway applications. Rolling stock. Electronic equipment |
| BS EN 61191-1:2013 | Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| 16/30282633 DC : 0 | BS EN 50155 - RAILWAY APPLICATIONS - ELECTRONIC EQUIPMENT USED ON ROLLING STOCK |
| EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| I.S. EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV)) |
| IPC J STD 002 CHINESE : C | SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES |
| IPC CA 821 : 0 | GENERAL REQUIREMENTS FOR THERMALLY CONDUCTIVE ADHESIVES |
| IPC D 326 : A | INFORMATION REQUIREMENTS FOR MANUFACTURING PRINTED CIRCUIT BOARDS AND OTHER ELECTRONIC ASSEMBLIES |
| IPC AJ 820 : A | ASSEMBLY AND JOINING HANDBOOK |
| IPC J STD 001 SWEDISH : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 001 RUSSIAN : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC S 815 : B1987 | GENERAL REQUIREMENTS FOR SOLDERING OF ELECTRONIC INTERCONNECTIONS |
| IPC J STD 001 TURKISH : E2010 | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC WHMA A 620 HUNGARIAN : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC J STD 001 POLISH : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC WHMA A 620 TURKISH : B2012 AMD 1 2013 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC WHMA A 620 HEBREW : B2012 AMD 1 2013 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC SM 780 : 0 | COMPONENT PACKAGING AND INTERCONNECTING WITH EMPHASIS ON SURFACE MOUNTING |
| MIL-PRF-32565 Revision A:2017 | Battery, Rechargeable, Sealed, 6T Lithium-Ion |
| IPC QE 615 : 1993 | ELECTRONIC ASSEMBLY EVALUATION HANDBOOK |
| IPC 7093 CHINESE : - | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS |
| IPC TR 549 : 1973 | MEASLES IN PRINTED WIRING BOARDS |
| IPC 9592 : B | REQUIREMENTS FOR POWER CONVERSION DEVICES FOR THE COMPUTER AND TELECOMMUNICATIONS INDUSTRIES |
| IPC 7526 : 2007 | STENCIL AND MISPRINTED BOARD CLEANING HANDBOOK |
| IPC 7912 : A | END-ITEM DPMO FOR PRINTED CIRCUIT BOARD ASSEMBLIES |
| IPC WHMA A 620 SPANISH : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC WHMA A 620 CHINESE : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC WHMA A 620 VIETNAMESE : B2012 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC CH 65 : B | GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES |
| IPC 6010 SERIES : LATEST | IPC-6010 QUALIFICATION AND PERFORMANCE SERIES |
| IPC DVD PTH : LATEST | THROUGH-HOLE SOLDER JOINT WORKMANSHIP STANDARDS WITH TRAINING CERTIFICATION |
| IPC SPVC2005-CD : 2005 | ROUND ROBIN TESTING AND ANALYSIS OF LEAD FREE SOLDER PASTES WITH ALLOYS OF TIN, SILVER AND COPPER |
| IPC FA 251 : 0 | GUIDELINES FOR ASSEMBLY OF SINGLE- AND DOUBLE-SIDED FLEX CIRCUITS |
| IPC DPMO 202 : 2002 | IPC 7912/9261 END ITEM AND IN-PROCESS DPMO SET |
| IPC CH 65 CHINESE : B | GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES |
| IPC HDBK 830 : A | GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS |
| IPC J STD 001 HUNGARIAN : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC TA 724 : 1998 | TECHNOLOGY ASSESSMENT ON CLEANROOMS |
| IPC J STD 001 GERMAN : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC HDBK 610 : 0 | Handbook and Guide to IPC-A-610 (Includes IPC-A-610B to C Comparison) |
| IPC OI 645 : 0 | STANDARD FOR VISUAL OPTICAL INSPECTION AIDS |
| IPC WHMA A 620 POLISH : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC D 949 : 1987 | RIGID MULTILAYER PRINTED BOARDS, DESIGN STANDARD FOR, |
| IPC 7351 GERMAN : B | Basic requirements for SMT design and SMD patch guideline |
| IPC 9261 : A | IN-PROCESS DPMO AND ESTIMATED YIELD FOR PCAS |
| IPC J STD 001 ROMANIAN : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC DVD SMT : LATEST | SURFACE MOUNT SOLDER JOINT WORKMANSHIP STANDARDS WITH TRAINING CERTIFICATION |
| IPC DW 426 : 0 | SPECIFICATIONS FOR ASSEMBLY OF DISCRETE WIRING |
| IPC 8701 : 0 | FINAL ACCEPTANCE CRITERIA STANDARD FOR PV MODULES-FINAL MODULE ASSEMBLY |
| IPC J STD 001 DANISH : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| MIL STD 11991 : A | GENERAL STANDARD FOR PARTS, MATERIALS, AND PROCESSES |
| IPC WHMA A 620 ESTONIAN : B2012 AMD 1 2013 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC WHMA A 620 KOREAN : B2012 AMD 1 2013 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| MIL-STD-2000 Revision A:1991 | STANDARD REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES (NO S/S DOCUMENT) |
| IPC J STD 032 : 0 | PERFORMANCE STANDARD FOR BALL GRID ARRAY BALLS |
| IPC 7095 : C | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
| PD CLC/TR 50506-2:2009 | Railway applications. Communication, signalling and processing systems. Application guide for EN 50129 Safety assurance |
| 17/30352677 DC : 0 | BS IEC 61188-6-4 ED1.0 - PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 6-4: GENERIC REQUIREMENTS FOR DIMENSIONAL DRAWINGS OF SMDS FROM VIEWPOINT OF LAND-PATTERN DESIGN |
| 15/30328104 DC : DRAFT JULY 2015 | BS EN 61191-2 - PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES |
| 11/30255128 DC : 0 | BS EN 61191-2 - PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES |
| PD IEC/TS 62647-1:2012 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan |
| IEC PAS 62647-23:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
| IPC 7351 : B | GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD |
| IEC 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| I.S. EN 50155:2017-11 | RAILWAY APPLICATIONS - ROLLING STOCK - ELECTRONIC EQUIPMENT |
| I.S. EN 61191-4:2017 | PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES |
| IPC J STD 001 CHINESE : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| I.S. EN 61191-3:2017 | PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES |
| IPC J STD 001 SPANISH : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 001 FRENCH : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC WHMA A 620 DANISH : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC 7093 : 0 | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS |
| CLC/TR 50506-2:2009 | Railway applications - Communication, signalling and processing systems - Application Guide for EN 50129 - Part 2: Safety assurance |
| IPC 7527 GERMAN : - | REQUIREMENTS FOR SOLDER PASTE PRINTING |
| SAE AS12500 | Corrosion Prevention and Deterioration Control in Electronic Components and Assemblies |
| ARINC 669 : 2004 | GUIDANCE FOR LEAD-BASED SOLDERING, REPAIR AND REWORK |
| GEIA HB 0005-3 : 2008 | REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
| GEIA HB 0005-2 : 2007 | TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
| IEEE 1662-2008 | IEEE Guide for the Design and Application of Power Electronics in Electrical Power Systems on Ships |
| BS EN 61191-4:2017 | Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies |
| GEIA STD 0005-1 : 2012 | PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
| EN 50155:2017 | Railway applications - Rolling stock - Electronic equipment |
| IPC HDBK 630 : 0 | GUIDELINES FOR DESIGN, MANUFACTURE, INSPECTION AND TESTING OF ELECTRONIC ENCLOSURES ASSEMBLY |
| IEC TS 62647-1:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan |
| IES RP 7 : 2017 | RECOMMENDED PRACTICE FOR LIGHTING INDUSTRIAL FACILITIES |
| CEI CLC/TR 50506-2 : 2011 | RAILWAY APPLICATIONS - COMMUNICATION, SIGNALLING AND PROCESSING SYSTEMS - APPLICATION GUIDE FOR EN 50129 - PART 2: SAFETY ASSURANCE |
| SAE USCAR33 | SPECIFICATION FOR TESTING AUTOMOTIVE LED MODULES |
| IPC 9262 : 2016 | SPECIFICATION FOR CHARACTERIZATION AND VERIFICATION OF ASSEMBLY LEVEL AUTOMATIC OPTICAL INSPECTION EQUIPMENT |
| IPC BP 421 : 80(R1990) | GENERAL SPECIFICATION FOR RIGID PRINTED BOARD BACKPLANES WITH PRESS-FIT CONTACTS |
| IPC A 630 : 0 | ACCEPTABILITY STANDARD FOR MANUFACTURE, INSPECTION AND TESTING OF ELECTRONIC ENCLOSURES |
| API TR 18TR4 : 2017 | EVALUATION OF WELDING REQUIREMENTS AS APPLICABLE TO API PRODUCT SPECIFICATIONS |
| NFPA 1917 : 2016 | AUTOMOTIVE AMBULANCES |
| S.R. CLC/TR 50506-2:2009 | RAILWAY APPLICATIONS - COMMUNICATION, SIGNALLING AND PROCESSING SYSTEMS - APPLICATION GUIDE FOR EN 50129 - PART 2: SAFETY ASSURANCE |
| ARINC 671 : 2006 | GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR |
| IEC PAS 62647-21:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| IEC TS 62647-23:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
| PD IEC/TS 62647-23:2013 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
| IEC PAS 62647-1:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management |
| 15/30327712 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
| PD IEC/PAS 62647-1:2011 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management |
| IEC 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| 11/30255124 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
| IEC TS 62647-22:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
| IEC PAS 62647-22:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
| DD IEC PAS 62647-23 : DRAFT AUG 2011 | PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES |
| IEC 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
| IPC 7351 CD : 2005 | GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD |
| IPC D 319 : 1987 | DESIGN STANDARD FOR RIGID SINGLE AND DOUBLE-SIDED PRINTED BOARDS |
| IPC EA 100 K : 2001 | ELECTRONIC ASSEMBLY REFERENCE SET |
| IPC DRM 40 : E2002 | THROUGH HOLE SOLDER JOINT EVALUATION DESK REFERENCE MANUAL |
| IPC 7527 : 0 | REQUIREMENTS FOR SOLDER PASTE PRINTING |
| IPC DVD LFL : LATEST | IMAGE LIBRARY: LEAD FREE SOLDER JOINTS |
| IPC 7094 : 0 | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR FLIP CHIP AND DIE SIZE COMPONENTS |
| EN 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| PD IEC/TS 62647-22:2013 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines |
| EN 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
| EN 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| EN 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| IPC SM 839 : 0 | PRE AND POST SOLDER MASK APPLICATION CLEANING GUIDELINES |
| IPC PE 740 : 0 | TROUBLESHOOTING FOR PRINTED BOARD MANUFACTURE AND ASSEMBLY |
| IPC SM 782 : A1993 AMD 2 1999 | SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD |
| IPC 7721 : 1998 | REPAIR AND MODIFICATION OF PRINTED BOARDS AND ELECTRONIC ASSEMBLIES |
| IPC M 104 : LATEST | STANDARDS FOR PRINTED BOARD ASSEMBLY MANUAL |
| IPC M 103 : LATEST | STANDARDS FOR SURFACE MOUNT ASSEMBLIES MANUAL |
| IPC 7711 : 1998 | REWORK OF ELECTRONIC ASSEMBLIES |
Summarise