DEFSTAN 08-107/3(2013) : 2013
|
GENERAL REQUIREMENTS FOR THE DESIGN OF ELECTROTECHNICAL AND NAVAL WEAPON EQUIPMENT |
I.S. EN 61191-2:2017
|
PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES |
BS EN 61191-3:2017
|
Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies |
BS EN 61189-5-1:2016
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - GUIDANCE FOR PRINTED BOARD ASSEMBLIES |
IEC 61191-4:2017
|
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
BS EN 50155:2017
|
Railway applications. Rolling stock. Electronic equipment |
BS EN 61191-1:2013
|
PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
16/30282633 DC : 0
|
BS EN 50155 - RAILWAY APPLICATIONS - ELECTRONIC EQUIPMENT USED ON ROLLING STOCK |
EN 61189-5-1:2016
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
I.S. EN 61191-1:2013
|
PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV)) |
IPC J STD 002 CHINESE : C
|
SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES |
IPC CA 821 : 0
|
GENERAL REQUIREMENTS FOR THERMALLY CONDUCTIVE ADHESIVES |
IPC D 326 : A
|
INFORMATION REQUIREMENTS FOR MANUFACTURING PRINTED CIRCUIT BOARDS AND OTHER ELECTRONIC ASSEMBLIES |
IPC AJ 820 : A
|
ASSEMBLY AND JOINING HANDBOOK |
IPC J STD 001 SWEDISH : E
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 001 RUSSIAN : E
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC S 815 : B1987
|
GENERAL REQUIREMENTS FOR SOLDERING OF ELECTRONIC INTERCONNECTIONS |
IPC J STD 001 TURKISH : E2010
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC WHMA A 620 HUNGARIAN : B
|
REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
IPC J STD 001 POLISH : E
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC WHMA A 620 TURKISH : B2012 AMD 1 2013
|
REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
IPC SM 780 : 0
|
COMPONENT PACKAGING AND INTERCONNECTING WITH EMPHASIS ON SURFACE MOUNTING |
MIL-PRF-32565 Revision A:2017
|
BATTERY, RECHARGEABLE, SEALED, 6T LITHIUM-ION |
IPC QE 615 : 1993
|
ELECTRONIC ASSEMBLY EVALUATION HANDBOOK |
IPC 7093 CHINESE : -
|
DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS |
IPC TR 549 : 1973
|
MEASLES IN PRINTED WIRING BOARDS |
IPC 9592 : B
|
REQUIREMENTS FOR POWER CONVERSION DEVICES FOR THE COMPUTER AND TELECOMMUNICATIONS INDUSTRIES |
IPC 7526 : 2007
|
STENCIL AND MISPRINTED BOARD CLEANING HANDBOOK |
IPC 7912 : A
|
END-ITEM DPMO FOR PRINTED CIRCUIT BOARD ASSEMBLIES |
IPC WHMA A 620 SPANISH : B
|
REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
IPC WHMA A 620 CHINESE : B
|
REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
IPC WHMA A 620 VIETNAMESE : B2012
|
REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
IPC CH 65 : B
|
GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES |
IPC 6010 SERIES : LATEST
|
IPC-6010 QUALIFICATION AND PERFORMANCE SERIES |
IPC DVD PTH : LATEST
|
THROUGH-HOLE SOLDER JOINT WORKMANSHIP STANDARDS WITH TRAINING CERTIFICATION |
IPC SPVC2005-CD : 2005
|
ROUND ROBIN TESTING AND ANALYSIS OF LEAD FREE SOLDER PASTES WITH ALLOYS OF TIN, SILVER AND COPPER |
IPC FA 251 : 0
|
GUIDELINES FOR ASSEMBLY OF SINGLE- AND DOUBLE-SIDED FLEX CIRCUITS |
IPC DPMO 202 : 2002
|
IPC 7912/9261 END ITEM AND IN-PROCESS DPMO SET |
IPC CH 65 CHINESE : B
|
GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES |
IPC HDBK 830 : A
|
GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS |
IPC J STD 001 HUNGARIAN : E
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC TA 724 : 1998
|
TECHNOLOGY ASSESSMENT ON CLEANROOMS |
IPC J STD 001 GERMAN : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC HDBK 610 : 0
|
HANDBOOK AND GUIDE TO SUPPLEMENT IPC-A-610 (INCLUDES IPC-A-610 B-C-D COMPARISONS |
IPC WHMA A 620 POLISH : B
|
REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
IPC D 949 : 1987
|
RIGID MULTILAYER PRINTED BOARDS, DESIGN STANDARD FOR, |
IPC 7351 GERMAN : B
|
GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD |
IPC 9261 : A
|
IN-PROCESS DPMO AND ESTIMATED YIELD FOR PCAS |
IPC J STD 001 ROMANIAN : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC DVD SMT : LATEST
|
SURFACE MOUNT SOLDER JOINT WORKMANSHIP STANDARDS WITH TRAINING CERTIFICATION |
IPC DW 426 : 0
|
SPECIFICATIONS FOR ASSEMBLY OF DISCRETE WIRING |
IPC 8701 : 0
|
FINAL ACCEPTANCE CRITERIA STANDARD FOR PV MODULES-FINAL MODULE ASSEMBLY |
IPC J STD 001 DANISH : E
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
MIL STD 11991 : A
|
GENERAL STANDARD FOR PARTS, MATERIALS, AND PROCESSES |
IPC WHMA A 620 ESTONIAN : B2012 AMD 1 2013
|
REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
IPC WHMA A 620 KOREAN : B2012 AMD 1 2013
|
REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
CSA N290.8 : 2015
|
TECHNICAL SPECIFICATION REQUIREMENTS FOR NUCLEAR POWER PLANT COMPONENTS |
MIL-STD-2000 Revision A:1991
|
STANDARD REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 032 : 0
|
PERFORMANCE STANDARD FOR BALL GRID ARRAY BALLS |
IPC 7095 : C
|
DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
PD CLC/TR 50506-2:2009
|
Railway applications. Communication, signalling and processing systems. Application guide for EN 50129 Safety assurance |
17/30352677 DC : 0
|
BS IEC 61188-6-4 ED1.0 - PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 6-4: GENERIC REQUIREMENTS FOR DIMENSIONAL DRAWINGS OF SMDS FROM VIEWPOINT OF LAND-PATTERN DESIGN |
15/30328104 DC : DRAFT JULY 2015
|
BS EN 61191-2 - PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES |
11/30255128 DC : 0
|
BS EN 61191-2 - PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES |
PD IEC/TS 62647-1:2012
|
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan |
IEC PAS 62647-23:2011
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
IPC 7351 : B
|
GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD |
IEC 61191-2:2017
|
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
I.S. EN 50155:2017-11
|
RAILWAY APPLICATIONS - ROLLING STOCK - ELECTRONIC EQUIPMENT |
I.S. EN 61191-4:2017
|
PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES |
IPC J STD 001 CHINESE : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
I.S. EN 61191-3:2017
|
PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES |
IPC J STD 001 SPANISH : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 001 FRENCH : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC WHMA A 620 DANISH : B
|
REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
IPC 7093 : 0
|
DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS |
IPC 7527 DANISH : -
|
REQUIREMENTS FOR SOLDER PASTE PRINTING |
CLC/TR 50506-2 : 2009
|
RAILWAY APPLICATIONS - COMMUNICATION, SIGNALLING AND PROCESSING SYSTEMS - APPLICATION GUIDE FOR EN 50129 - PART 2: SAFETY ASSURANCE |
IPC 7527 GERMAN : -
|
REQUIREMENTS FOR SOLDER PASTE PRINTING |
IPC A 630 CHINESE : -
|
ACCEPTABILITY STANDARD FOR MANUFACTURE, INSPECTION AND TESTING OF ELECTRONIC ENCLOSURES |
SAE AS 12500 : 2018
|
CORROSION PREVENTION AND DETERIORATION CONTROL IN ELECTRONIC COMPONENTS AND ASSEMBLIES |
ARINC 669 : 2004
|
GUIDANCE FOR LEAD-BASED SOLDERING, REPAIR AND REWORK |
GEIA HB 0005-3 : 2008
|
REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
GEIA HB 0005-2 : 2007
|
TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
IEEE 1662-2008
|
DESIGN AND APPLICATION OF POWER ELECTRONICS IN ELECTRICAL POWER SYSTEMS |
BS EN 61191-4:2017
|
Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies |
GEIA STD 0005-1 : 2012
|
PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
EN 50155:2017
|
Railway applications - Rolling stock - Electronic equipment |
CSA N290.14 : 2015
|
QUALIFICATION OF DIGITAL HARDWARE AND SOFTWARE FOR USE IN INSTRUMENTATION AND CONTROL APPLICATIONS FOR NUCLEAR POWER PLANTS |
IPC HDBK 630 : 0
|
GUIDELINES FOR DESIGN, MANUFACTURE, INSPECTION AND TESTING OF ELECTRONIC ENCLOSURES ASSEMBLY |
IEC TS 62647-1:2012
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan |
IES RP 7 : 2017
|
RECOMMENDED PRACTICE FOR LIGHTING INDUSTRIAL FACILITIES |
CEI CLC/TR 50506-2 : 2011
|
RAILWAY APPLICATIONS - COMMUNICATION, SIGNALLING AND PROCESSING SYSTEMS - APPLICATION GUIDE FOR EN 50129 - PART 2: SAFETY ASSURANCE |
SAE USCAR 33 : 2013
|
SPECIFICATION FOR TESTING AUTOMOTIVE LED MODULES |
IPC 9262 : 2016
|
SPECIFICATION FOR CHARACTERIZATION AND VERIFICATION OF ASSEMBLY LEVEL AUTOMATIC OPTICAL INSPECTION EQUIPMENT |
IPC BP 421 : 80(R1990)
|
GENERAL SPECIFICATION FOR RIGID PRINTED BOARD BACKPLANES WITH PRESS-FIT CONTACTS |
IPC A 630 : 0
|
ACCEPTABILITY STANDARD FOR MANUFACTURE, INSPECTION AND TESTING OF ELECTRONIC ENCLOSURES |
API TR 18TR4 : 2017
|
EVALUATION OF WELDING REQUIREMENTS AS APPLICABLE TO API PRODUCT SPECIFICATIONS |
NFPA 1917 : 2016
|
AUTOMOTIVE AMBULANCES |
S.R. CLC/TR 50506-2:2009
|
RAILWAY APPLICATIONS - COMMUNICATION, SIGNALLING AND PROCESSING SYSTEMS - APPLICATION GUIDE FOR EN 50129 - PART 2: SAFETY ASSURANCE |
ARINC 671 : 2006
|
GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR |
IEC PAS 62647-21:2011
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics |
IEC 61191-1:2013
|
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
IEC TS 62647-23:2013
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
PD IEC/TS 62647-23:2013
|
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
IEC PAS 62647-1:2011
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management |
15/30327712 DC : 0
|
BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
PD IEC/PAS 62647-1:2011
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 1: LEAD-FREE MANAGEMENT |
IEC 61189-5-1:2016
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
11/30255124 DC : 0
|
BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
IEC TS 62647-22:2013
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
IEC PAS 62647-22:2011
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
DD IEC PAS 62647-23 : DRAFT AUG 2011
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES |
IEC 61191-3:2017
|
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
IPC 7527 : 0
|
REQUIREMENTS FOR SOLDER PASTE PRINTING |
IPC DVD LFL : LATEST
|
IMAGE LIBRARY: LEAD FREE SOLDER JOINTS |
IPC 7094 : 0
|
DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR FLIP CHIP AND DIE SIZE COMPONENTS |
EN 61191-2:2017
|
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
PD IEC/TS 62647-22:2013
|
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines |
EN 61191-3:2017
|
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
EN 61191-1:2013
|
PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013) |
EN 61191-4:2017
|
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |