IPC 8497-1 : 0

1 SCOPE
   1.1 Intent
   1.2 Caution Reminders
        1.2.1 Safety Cautions
        1.2.2 Electrostatic Discharge (ESD) Caution
2 APPLICABLE DOCUMENTS
   2.1 IPC-Association Connecting Electronics Industry
   2.2 IEC-International Electrotechnical Commission
   2.3 TIA-Telecommunications Industry Association
3 TERMS AND DEFINITIONS
4 CLEANING SPECIFICATION
   4.1 General Information
        4.1.1 Cleaning Process Flow
        4.1.2 Inspection Criteria Matrix
        4.1.3 Understanding MT-Ferrule Connectors
        4.1.4 Understanding Composite Bi-Metallic-Ferruled
               Connectors
        4.1.5 Inspection Criteria for Receptacles (with
               Internal Fiber Stubs)
        4.1.6 Illustrations of Receptacle Devices (with
               Internal Fiber Stubs)
        4.1.7 Inspection Criteria for Receptacles (with
               Lenses)
5 CONTAMINATION
6 INSPECTION EQUIPMENT
   6.1 Overview
   6.2 Equipment
        6.2.1 Optical Microscope
        6.2.2 Video Microscope
        6.2.3 Automated End-Face Inspection System
        6.2.4 Interferometer
   6.3 Performance Issues
   6.4 Inspection Application
   6.5 Inspection Templates
7 CLEANING METHODS
   7.1 Procedures for Use
   7.2 Description of Items to be Cleaned
   7.3 Description of Common Cleaning Methods
        7.3.1 Compressed Gas
        7.3.2 Dry wipes and Cleaning Cassettes
        7.3.3 Cleaning Fluids/Wet Wipes
        7.3.4 Dry Swabs
        7.3.5 Sticking Tapes/Adhesive Tapes
        7.3.6 Cleaning Fluids and Wet Swabs
        7.3.7 Machines
        7.3.8 Notes About Cleaning Fluids
   7.4 Method Evaluation and Qualification
8 END-CAPS
   8.1 History - Material
   8.2 History - Design/Shape
   8.3 Material Properties
   8.4 Unacceptable Materials
   8.5 Manufacturing Process of End-Caps
        8.5.1 Molding
        8.5.2 Cleaning
        8.5.3 Packaging
   8.6 End-cap Design
        8.6.1 Form
        8.6.2 Fit
        8.6.3 Function
   8.7 Recommendation
9 PERFORMANCE TESTING
   9.1 Method Evaluation and Qualification for
        Cleaning Solutions
        9.1.1 Contamination of the Microscope
        9.1.2 Devices Under Test
        9.1.3 Patch Cords
        9.1.4 Bulkhead Adapters
        9.1.5 Intended Device
        9.1.6 Contamination Technique
        9.1.7 Patch Cords
        9.1.8 In Situ End-Faces
        9.1.9 Lens Elements
        9.1.10 Alignment Sleeve and Other Surfaces
        9.1.11 Procedure and Data Collection
        9.1.12 Post Test Degradation Testing
        9.1.13 Data Analysis
        9.1.14 Qualification/Disqualification
10 ELECTROSTATIC CHARGE EFFECT (ESC) AND CONNECTOR
   CLEANLINESS
   10.1 Electrostatic Charge Effect (ESC) During the
        Cleaning Process of Fiber Optics Connectors [14]
   10.2 Electrostatic Charge Accumulation Test
        10.2.1 Equipment
        10.2.2 Sample Preparation
        10.2.3 Apparatus Setup
        10.2.4 Experimental Procedure
11 THE INFLUENCE OF SCRATCHES/CONTAMINATION ON
   OPTICAL SIGNAL PERFORMANCE
   11.1 Scratches
   11.2 Particle Contamination
   11.3 Oil Contamination
   11.4 Detailed Descriptions of Optical Equipment
        Indices
        11.4.1 Current Calibrations Methods
        11.4.2 Detection
        11.4.3 Field of View
        11.4.4 Illumination
        11.4.5 Magnification
        11.4.6 Numerical Aperture
        11.4.7 Rules
12 REFERENCE DOCUMENTS
Figures
Tables

Describes the methods of inspecting and cleaning all optical interfaces so that their interconnectivity maintains the integrity of the optical signal.