• IPC 9702 CHINESE : -

    Current The latest, up-to-date edition.

    MONOTONIC BEND CHARACTERIZATION OF BOARD-LEVEL INTERCONNECTS

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    Published date:  01-06-2004

    Publisher:  Institute of Printed Circuits

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    Development Note Also available in CD-ROM format. (09/2011)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC 9501 : 0 PWB ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF ELECTRONIC COMPONENTS (PRECONDITIONING IC COMPONENTS)
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    IPC 9701 : A PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS
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