IPC 9701 : A

1 SCOPE
  1.1 Purpose
  1.2 Performance Classification
  1.3 Definition of Terms
2 APPLICABLE DOCUMENTS
  2.1 IPC
  2.2 Joint Industry Standards
  2.3 International Tin Research Institute
  2.4 Other Publications
      2.4.1 Electronic Industries Association
      2.4.2 OEM Working Group
3 TERMS, DEFINITIONS AND CONCEPTS
  3.1 General
  3.2 Reliability Concepts
      3.2.1 Reliability Definition
  3.3 Physics-of-Failure Concepts
      3.3.1 Creep
      3.3.2 Stress Relaxation
      3.3.3 Solder Creep-Fatigue Model
      3.3.4 Differential Thermal Expansion
  3.4 Test Parameters
      3.4.1 Working Zone
      3.4.2 Cyclic Temperature Range/Swing
      3.4.3 Sample Temperature: Ts
      3.4.4 Maximum Sample Temperature: Ts (max)
      3.4.5 Maximum Nominal Temperature: T (max)
      3.4.6 Minimum Sample Temperature: Ts (min)
      3.4.7 Minimum Nominal Temperature: T (min)
      3.4.8 Mean Cyclic Temperature, T[SJ]
      3.4.9 Nominal delta T
      3.4.10 Dwell/Soak Time, t[D]
      3.4.11 Dwell/Soak Temperature
      3.4.12 Cycle Time
      3.4.13 Temperature Ramp Rate
      3.4.14 Maximum Cyclic Strain Range
      3.4.15 Maximum Cyclic Stress Range
      3.4.16 Hysteresis Loop
      3.4.17 Design Service Life
      3.4.18 Projected Service Life Service
      3.4.19 Infant Mortality Failures
      3.4.20 Random Steady-State Failures
      3.4.21 Wearout Failures
  3.5 Statistical Failure Distribution Concepts
      3.5.1 Statistical Failure Distribution
      3.5.2 Mean Fatigue Life, N(50%)
      3.5.3 Failure Free Life, N[0]
      3.5.4 Cumulative Failure Percentage
      3.5.5 Cumulative Failure Probability
      3.5.6 Acceptable Cumulative Failure Probability
  3.6 Reliability Tests
      3.6.1 Accelerated Reliability Test
      3.6.2 Thermal Cycling
      3.6.3 Thermal Shock
      3.6.4 Power Cycling
  3.7 Other Tests
      3.7.1 Burn-In Test
      3.7.2 Environmental Stress Screening (ESS)
      3.7.3 Highly Accelerated Stress Testing (HAST)
      3.7.4 Mechanical Shock
      3.7.5 Vibration
      3.7.6 Process Qualification
      3.7.7 Process Verification
  3.8 Evaluation and Application Considerations
  3.9 Understanding of Solder Attachment Technology
4 PERFORMANCE TEST METHODS
  4.1 General Requirements
  4.2 Test Vehicles
      4.2.1 Component Description
      4.2.2 Printed Wiring (Circuit) Boards
      4.2.3 Board Assembly
  4.3 Accelerated Temperature Test Methods
      4.3.1 Preconditioning by Isothermal Aging
      4.3.2 Temperature Cycling
      4.3.3 Test Monitoring
5 QUALIFICATION REQUIREMENTS
  5.1 Thermal Cycling Ranges
  5.2 Thermal Cycling Test Durations
  5.3 Number of Samples
  5.4 Test Exemption Requirements
6 FAILURE ANALYSIS
  6.1 Failure Analysis Procedures
  6.2 Failure Analysis Documentation
      Requirements
7 QUALITY ASSURANCE
  7.1 Responsibility for Inspection
  7.2 Quality Conformance Inspection
      7.2.1 As Assembled Inspection
      7.2.2 Thermal Cycling Inspection
      7.2.3 Failure Analysis Inspection
APPENDIX A
APPENDIX B
Figures
Tables

Establishes specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies.