IPC D 279 : 0

1.0 SCOPE
     1.1 Purpose
     1.2 Design Philosophy
     1.3 Document Organization
     1.4 Terms and Definitions
2.0 APPLICABLE DOCUMENTS
     2.1 Institute for Interconnecting and Packaging
          Electronic Circuits (IPC)
     2.2 Electronic Industries Association
     2.3 Joint Industry Standards
3.0 DESIGN FOR RELIABILITY FOR SURFACE MOUNT ASSEMBLIES
     3.1 Life Cycle Environment
     3.2 Thermal Design
     3.3 Printed Board Design and Layout
     3.4 Coefficient of Thermal Expansion (CTE) and
          CTE-Mismatch
     3.5 Solder Joint Reliability
     3.6 Plated-Through Hole and Via Reliability
     3.7 DfR of SM Solder Attachments
     3.8 DfR of Insulation Resistance
4.0 SUBSTRATES
     4.1 General Substrate Categories
     4.2 Substrates and Their Functions:
     4.3 Moisture and its Effects on Polymer
          Substrates
     4.4 Coefficient of Thermal Expansion (CTE) of
          Polymer Systems
     4.5 Constraining Cores in Substrates
     4.6 Flexible Printed Board with Metal Support
          Plane
     4.7 Discrete Wire Structures with Metal Support
          Plane
     4.8 Outgassing of Polymer Substrates
     4.9 Assembly Process Effects on Polymer Substrates
     4.10 Printed Board Solderability
     4.11 Design for Reliability of Plated-Through-Hole
          Vias (PTVs)
5.0 GENERAL COMPONENT SELECTION CONSIDERATIONS
     5.1 Component Selection Strategy
     5.2 Package Leadframe and Local Materials
     5.3 Package Lead Configuration Selection
     5.4 Component Termination Finishes
     5.5 Solderability of Termination Finishes
     5.6 Soldering Considerations
     5.7 CTE Mismatch Considerations
     5.8 ESD Packaging Requirements
     5.9 Specials or Custom Devices Use Precaution
     5.10 Components to Avoid or to Use with Caution
     5.11 Component Selection Considerations for
          Military and Space Applications
6.0 SOLDER MASK AND CONFORMAL COATING CONSIDERATION
     6.1 Solder Mask Considerations for SM
     6.2 Temporary Solder Mask and Tapes
     6.3 Conformal Coatings
7.0 ASSEMBLY PROCESSES AND DESIGN FOR MANUFACTURABILITY
     7.1 Solder Paste Application
     7.2 Adhesive Application
     7.3 Component Placement
     7.4 Soldering
     7.5 Cleaning
     7.6 Rework/Repair
     7.7 Depaneling
     7.8 Design for Manufacturability
8.0 TESTING
     8.1 Design for Testability (DfT)
     8.2 Testing Philosophy
9.0 REFERENCE DOCUMENTS
     9.1 General Books on SMT Process and Design
     9.2 SMT Soldering Process Technical Details
     9.3 SMT Solder Paste
     9.4 SMT Cleaning
     9.5 Solder Joint Reliability
     9.6 Design of Electronic Packages and Packaging
     9.7 EMC, High Speed Transients and Electrical
          Overstress
     9.8 ESD
     9.9 Scanning Acoustic Microscopy
     9.10 Plastic Package Cracking
     9.11 Solder Joint Metallurgy and Etching
     9.12 PWA Thermal Design
     9.13 Substrate Fabrication Information
     9.14 Component Derating, Applications,
          Qualification
     9.15 Testability, Manufacturability
     9.16 Vibration, Shock
     9.17 Accelerated Life Testing
     9.18 Solder, Solderability, Soldered Assembly
          Quality
     9.19 Solder Mask and Conformal Coating
     9.20 General Reliability
Appendix A Design for Reliability (DfR) of Solder
           Attachments
Appendix B Design for Reliability (DfR) of
           Plated-Through Via (PTV) Structures
Appendix C Design for Reliability (DfR) of Insulation
           Resistance
Appendix D Thermal Considerations
Appendix E Environmental Stresses
Appendix F Components
Appendix G Coefficient of Thermal Expansion
Appendix H Electrostatic Discharge
APPENDIX I Solvents
Appendix J Design for Testability
Appendix K Design for Manufacturability and
           Assembly Checklist
Appendix L Corrosion Basics and Checklist
Appendix M Solder Joint Variability
Appendix N Adhesives, Solder Mask and
           Conformal/Other Coatings
Appendix O Aerospace and High Altitude Concerns
Appendix P Technical Acronyms and Abbreviations
Figures
Tables

Determines design concepts, guidelines and methods for reliable printed wiring assemblies. Focuses on SMT or mixed technology PWAs, particularly dealing with the interconnect structure, together with the solder joint. Addresses substrates, components, attachment materials and costings, assembly methods and testing considerations. Also contains detailed appendices.