IPC CI 408 : 0
Current
The latest, up-to-date edition.
DESIGN AND APPLICATION GUIDELINES FOR THE USE OF SOLDERLESS SURFACE MOUNT CONNECTORS
Hardcopy
English
01-01-1994
1 INTRODUCTION
1.1 Scope
1.2 Purpose
1.3 Terms, Definitions and Acronyms
1.4 Applicable Documents
2 TECHNOLOGIES SUMMARIZED
2.1 Conductive Adhesives
2.2 Elastomerics - Metal on Elastomer Type
2.3 Layered Elastomeric Elements
2.4 Elastomeric Conductive Polymer Interconnection
(ECPI)
2.5 Pressure Clip Interconnections
2.6 Button Board
3 TECHNOLOGIES EXPANDED
3.1 Conductive Adhesives
3.2 Elastomerics - Metal on Elastomer Type
3.3 Layered Elastomeric Elements
3.4 Elastomeric Conductive Polymer Interconnection (ECPI)
3.5 Pressure Clip Interconnection
3.6 Button Board
Figures
Tables
Covers design characteristics and the application of solderless surface mount connectors, including conductive adhesives in order to aid the designer in effectively interconnecting his package.
| DocumentType |
Standard
|
| Pages |
137
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| IPC C 406 : 0 | DESIGN AND APPLICATION GUIDELINES FOR SURFACE MOUNT CONNECTORS |
| IPC E 500 : LATEST | IPC ELECTRONIC DOCUMENT COLLECTION |
| IPC 3408 : 0 | GENERAL REQUIREMENTS FOR ANISOTROPICALLY CONDUCTIVE ADHESIVES FILMS |
| IPC 3406 : 0 | GUIDELINES FOR ELECTRICALLY CONDUCTIVE SURFACE MOUNT ADHESIVES |
| IPC M 106 : LATEST | TECHNOLOGY REFERENCE FOR DESIGN MANUAL |
| IPC C 406 : 0 | DESIGN AND APPLICATION GUIDELINES FOR SURFACE MOUNT CONNECTORS |
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