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IPC D 352 : 0

Current

Current

The latest, up-to-date edition.

ELECTRONIC DESIGN DATA DESCRIPTION FOR PRINTED BOARDS IN DIGITAL FORM

Available format(s)

Hardcopy

Language(s)

English

Published date

01-08-1985

1 SCOPE
   1.1 Format Compatibility
2 APPLICABLE DOCUMENTS
   2.1 IPC
   2.2 American National Standards Institute
   2.3 Department of Defense
3 TERMS AND DEFINITIONS
   3.1 Annotation
   3.2 Comment Records
   3.3 Complex or Composite Records
   3.4 Component Electrical Description Record
   3.5 Component/Pin Location Record
   3.6 Data Information Module (DIM)
   3.7 Data Layer
   3.8 Design Electrical Description Record
   3.9 Job Set
   3.10 Modal Form
   3.11 Parameter Record
   3.12 Subroutine
   3.13 Subroutine Call
4 GENERAL REQUIREMENTS
   4.1 Data Hierarchy
   4.2 Basic Record Types
   4.3 Data Set Descriptions
   4.4 Data Orientation
   4.5 Transfer Media and Data Formats
5 PARAMETER RECORDS
   5.1 Parameter - JOB
   5.2 Parameter - DIM
   5.3 Parameter - UNITS
   5.4 Parameter - TITLE
   5.5 Parameter - NUM
   5.6 Parameter - REV
   5.7 Parameter - DESRL
   5.8 Parameter - NNAME
   5.9 Parameter - PNAME
   5.10 Parameter - LNAME
   5.11 Parameter - RDES
6 COMMENT RECORDS
7 COMPONENT ELECTRICAL DESCRIPTION RECORD
   7.1 General Information
   7.2 Operations Code Description
   7.3 Subgroups Within the Component Feature Description
        Area
   7.4 Subgroups Within the Element Pin Correlation Field
8 DESIGN ELECTRICAL DESCRIPTION RECORD
   8.1 General Description
   8.2 Operations Code Description Area
   8.3 Design Feature Description Area
   8.4 Subgroups Within the Node to Pin Correlation Data
9 COMPONENT/ELEMENT LOCATION RECORD
   9.1 General Information
   9.2 Operations Code Description Area
   9.3 Subgroups of the Description Area
   9.4 Subgroups Within the Location Description Area
10 MISCELLANEOUS RECORD FORMATS
   10.1 General Information
   10.2 Component Description
   10.3 Symbol Description
   10.4 Conductor Description
   10.5 Electrical Description
APPENDIX

Intended to describe the relationship between the elements used in the electromechanical design and packaging of electronic products using printed boards as the major form of interconnection. Included in these descriptions are the logical and physical elements necessary as input to a design system, as well as the network or interconnection description between various electronic parts. Is further intended that this structure provides the capability for describing all elements in their final form upon design completion.

DevelopmentNote
This document is frozen; no future updates are planned. (03/2002)
DocumentType
Standard
Pages
33
PublisherName
Institute of Printed Circuits
Status
Current

MIL-STD-1840 Revision C:1997 AUTOMATED INTERCHANGE OF TECHNICAL INFORMATION
IPC D 949 : 1987 RIGID MULTILAYER PRINTED BOARDS, DESIGN STANDARD FOR,
IPC D 355 : 0 PRINTED BOARD ASSEMBLY DESCRIPTION IN DIGITAL FORM
IPC D 354 : 0 LIBRARY FORMAT DESCRIPTION FOR PRINTED BOARDS IN DIGITAL FORM
IPC D 350 : 0 PRINTED BOARD DESCRIPTION IN DIGITAL FORM
IPC D 351 : 0 PRINTED BOARD DRAWINGS IN DIGITAL FORM

IPC D 354 : 0 LIBRARY FORMAT DESCRIPTION FOR PRINTED BOARDS IN DIGITAL FORM
IPC D 351 : 0 PRINTED BOARD DRAWINGS IN DIGITAL FORM
IPC D 350 : 0 PRINTED BOARD DESCRIPTION IN DIGITAL FORM

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