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  • IPC HDBK 610 : 0

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    HANDBOOK AND GUIDE TO SUPPLEMENT IPC-A-610 (INCLUDES IPC-A-610 B-C-D COMPARISONS

    Available format(s): 

    Withdrawn date:  18-09-2023

    Language(s): 

    Published date:  01-10-2005

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 Acceptability of Electronic Assemblies
       1.1 Scope
       1.2 Purpose
       1.3 Specialized Designs
       1.4 Terms & Definitions
       1.5 Examples and Illustrations
       1.6 Inspection Methodology
       1.7 Verification of Dimensions
       1.8 Magnification Aids and Lighting
    2 Applicable Documents
       2.1 IPC Documents
       2.2 Joint Industry Documents
       2.3 EOS/ESD Association Documents
       2.4 Electronics Industries Alliance Documents
       2.5 International Electrotechnical Commission
            Documents
       2.6 Federal Standards
    3 Handling Electronic Assemblies
       3.1 Electrical Overstress (EOS) Damage
            Prevention
       3.2 Electrostatic Discharge (ESD) Damage
            Prevention
       3.3 EOS/ESD Safe Workstation/EPA
       3.4 Handling
    4 Mechanical Assembly
       4.1 Hardware
       4.2 Hardware Mounting
       4.3 Swaged Hardware
       4.4 Component Mounting
       4.5 Connectors, Handles, Extractors
       4.6 Heat Sink
       4.7 Terminals - Edge Clip
       4.8 Connector Pins
    5 Component Installation Location/
       Orientation
       5.1 Orientation
       5.2 Mounting
       5.3 Lead Forming
       5.4 Damage
       5.5 Terminals
       5.6 Insulation
       5.7 Conductor
    6 Soldering
       6.1 Soldering Acceptability Requirements
       6.2 Lead Protrusion
       6.3 Plated-Through Holes (PTH) (Supported
            Holes)
       6.4 Unsupported Holes
       6.5 Other
       6.6 Terminals
       6.7 Insulation
       6.8 High Voltage
       6.9 Connector Pins - Press-Fit Pins
       6.10 Gold Fingers
    7 Cleanliness
       7.1 Flux Residues
       7.2 Particulate Matter
       7.3 Chlorides, Carbonates, and White Residues
       7.4 Flux Residues - No Clean Process
            Appearance
       7.5 Surface Appearance
    8 Marking
       8.1 Etched Marking (including Hand Printing)
       8.2 Screened Marking
       8.3 Stamped Marking
       8.4 Laser Marking
       8.5 Labels
    9 Coatings
       9.1 Conformal Coating
       9.2 Solder Resist Coating
    10 Laminate Conditions
       10.1 Introduction
       10.2 Laminate Damage
       10.3 Flexible and Rigid-Flex Printed Wiring
       10.4 Solder Resist Discoloration
       10.5 Burns
       10.6 Bow and Twist
       10.7 Conductor/Land Damage
    11 Discrete Wiring
       11.1 Solderless Wrap
       11.2 Jumper Wires
    12 Surface Mount Assemblies
       12.1 Staking Adhesive
       12.2 Solder Joints
       12.3 Chip Component - Termination Variations
       12.4 SMT Soldering Anomalies
    Appendix A Electrical Conductor Spacing Appendix A
    Appendix B Metric Conversion Information, Appendix H-1
    Appendix C Comparison of IPC-A-610 Revision B to C
    Appendix D U.S. Department of Defense Adoption
                Notice

    Abstract - (Show below) - (Hide below)

    Provides IPC-A-610 change history and cross reference support along with the previous Rev B to C content. Also offers explanatory and tutorial information to help with the understanding the requirements of IPC-A-610.

    General Product Information - (Show below) - (Hide below)

    Committee 7-30
    Development Note To be used in conjunction with IPC HDBK 001 and J STD 001. (06/2003) Also available in CD-ROM format. (09/2005) 2005 version incorporates Amendment 1 to 2002 version. (12/2005)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Withdrawn

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
    EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
    IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC J STD 001 : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC HDBK 001 : E HANDBOOK AND GUIDE TO SUPPLEMENT J-STD-001
    IPC EA 100 K : 2001 ELECTRONIC ASSEMBLY REFERENCE SET
    IPC A 610 : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC E 500 : LATEST IPC ELECTRONIC DOCUMENT COLLECTION
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