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IPC HDBK 001 : E

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

HANDBOOK AND GUIDE TO SUPPLEMENT J-STD-001

Available format(s)

Hardcopy

Superseded date

07-05-2021

Language(s)

English

0.1 GENERAL
0.2 FORMAT (Using This Handbook)
1 GENERAL
2 APPLICABLE DOCUMENTS
3 MATERIAL, COMPONENTS, AND EQUIPMENT
   REQUIREMENTS
4 GENERAL SOLDERING AND ASSEMBLY
   REQUIREMENTS
5 WIRES AND TERMINAL CONNECTIONS
6 THROUGH-HOLE MOUNTING AND
   TERMINATIONS
7 SURFACE MOUNTING OF COMPONENTS
8 CLEANING PROCESS REQUIREMENTS
9 PCB REQUIREMENTS
10 COATING, ENCAPSULATION AND STAKING
   (ADHESIVE)
11 WITNESS (TORQUE/ANTI-TAMPERING)
   STRIPE
12 PRODUCT ASSURANCE
13 REWORK AND REPAIR
APPENDIX GUIDE
APPENDIX A - Guidelines for Soldering Tools
             and Equipment
APPENDIX B - Minimum Electrical Clearance -
             Electrical Conductor Spacing
APPENDIX C - J-STD-001 Guidance on
             Objective Evidence of Material Compatibility
APPENDIX D - Cross Reference Listing
             by Revision
ACRONYM INDEX

Describes the J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies (Standard) and is intended to provide supporting information.

DevelopmentNote
Supplements J STD 001. (02/2002) Included in IPC C 103. (04/2013) Also available in Hardcopy format. (01/2018)
DocumentType
Standard
Pages
116
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy
Supersedes

IPC PD 335 : 1989 ELECTRONIC PACKAGING HANDBOOK
BS EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
IPC 6012 RUSSIAN : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC J STD 001 SWEDISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC A 610 DANISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC J STD 001 RUSSIAN : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC 9501 : 0 PWB ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF ELECTRONIC COMPONENTS (PRECONDITIONING IC COMPONENTS)
IPC A 610 SPANISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC J STD 001 TURKISH : E2010 REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 POLISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC A 610 ROMANIAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC TA 722 : 1990 TECHNOLOGY ASSESSMENT HANDBOOK ON SOLDERING
IPC 1601 GERMAN : - PRINTED BOARD HANDLING AND STORAGE GUIDELINES
IPC 6012 POLISH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC D 279 : 0 DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES
IPC A 610 CZECH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC TP 1090 : 1996 THE LAYMAN'S GUIDE TO QUALIFYING NEW FLUXES FOR MIL-STD-2000A OR MT-0002
IPC TR 549 : 1973 MEASLES IN PRINTED WIRING BOARDS
IPC TA 723 : 1991 TECHNOLOGY ASSESSMENT HANDBOOK ON SURFACE MOUNTING
IPC A 610 GERMAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 HINDI : E2010 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 9502 : 0 PWB ASSEMBLY SOLDERING PROCESS GUIDELINE FOR ELECTRONIC COMPONENTS
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IPC 9500 : 2003 ASSEMBLY PROCESS COMPONENT SIMULATIONS, GUIDELINES & CLASSIFICATIONS PACKAGE
IPC 9504 : 0 ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF NON-IC COMPONENTS (PRECONDITIONING NON-IC COMPONENTS)
IPC 7530 HUNGARIAN : - GUIDELINES FOR TEMPERATURE PROFILING FOR MASS SOLDERING (REFLOW AND WAVE) PROCESSES
IPC A 610 ESTONIAN : E2010 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 POLISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 DUTCH : F2014 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC FA 251 : 0 GUIDELINES FOR ASSEMBLY OF SINGLE- AND DOUBLE-SIDED FLEX CIRCUITS
IPC DPMO 202 : 2002 IPC 7912/9261 END ITEM AND IN-PROCESS DPMO SET
IPC A 610 ITALIAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 FRENCH : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 5701 : 0 USERS GUIDE FOR CLEANLINESS OF UNPOPULATED PRINTED BOARDS
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IPC TR 467 : 0 SUPPORTING DATA AND NUMERICAL EXAMPLES FOR J-STD-001 (CONTROL OF FLUXES)
IPC HDBK 830 : A GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS
IPC J STD 001 HUNGARIAN : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 GERMAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC A 610 SWEDISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC HDBK 610 : 0 HANDBOOK AND GUIDE TO SUPPLEMENT IPC-A-610 (INCLUDES IPC-A-610 B-C-D COMPARISONS
IPC 7530 CHINESE : 2001 GUIDELINES FOR TEMPERATURE PROFILING FOR MASS SOLDERING PROCESSES (REFLOW AND WAVE)
IPC A 610 HUNGARIAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC TR 460 : A1984 TROUBLE-SHOOTING CHECKLIST FOR WAVE SOLDERING PRINTED WIRING BOARDS
IPC HDBK 840 : 0 SOLDER MASK HANDBOOK
IPC 6012 FRENCH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC A 610 CHINESE : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC TP 1114 : 1998 THE LAYMAN'S GUIDE TO QUALIFYING A PROCESS TO J-STD-001B
IPC A 610 TURKISH : E2010 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC J STD 001 ROMANIAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC A 610 JAPANESE : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 VIETNAMESE : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC J STD 001 DANISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC A 610 RUSSIAN : D ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC TP 1115 : 1998 SELECTION AND IMPLEMENTATION STRATEGY FOR A LOW-RESIDUE, NO-CLEAN PROCESS
SAE AS 81703 : 2012 CONNECTORS, ELECTRIC, CIRCULAR, MINIATURE, RACK AND PANEL OR PUSH-PULL COUPLING, ENVIRONMENT RESISTING
IPC SA 61 : A POST SOLDER SEMI-AQUEOUS CLEANING HANDBOOK
IPC J STD 001 CHINESE : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 SPANISH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 FRENCH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
ARINC 669 : 2004 GUIDANCE FOR LEAD-BASED SOLDERING, REPAIR AND REWORK
NASA KSC E 165 : 2009 ELECTRICAL GROUND SUPPORT EQUIPMENT FABRICATION, SPECIFICATION FOR
NASA STD 5005(INT) : 2007 THE DESIGN AND FABRICATION OF GROUND SUPPORT EQUIPMENT
NASA KSC STD E 0001 : 2008 DESIGN OF ELECTRICAL CONTROL AND MONITORING SYSTEMS, EQUIPMENT (GSE), AND PANELS, STANDARD FOR
IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies

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