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IPC HDBK 001 : E

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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HANDBOOK AND GUIDE TO SUPPLEMENT J-STD-001

Available format(s)

PDF

Language(s)

English

Superseded date

07-05-2021

Summarise this standard

0.1 GENERAL
0.2 FORMAT (Using This Handbook)
1 GENERAL
2 APPLICABLE DOCUMENTS
3 MATERIAL, COMPONENTS, AND EQUIPMENT
   REQUIREMENTS
4 GENERAL SOLDERING AND ASSEMBLY
   REQUIREMENTS
5 WIRES AND TERMINAL CONNECTIONS
6 THROUGH-HOLE MOUNTING AND
   TERMINATIONS
7 SURFACE MOUNTING OF COMPONENTS
8 CLEANING PROCESS REQUIREMENTS
9 PCB REQUIREMENTS
10 COATING, ENCAPSULATION AND STAKING
   (ADHESIVE)
11 WITNESS (TORQUE/ANTI-TAMPERING)
   STRIPE
12 PRODUCT ASSURANCE
13 REWORK AND REPAIR
APPENDIX GUIDE
APPENDIX A - Guidelines for Soldering Tools
             and Equipment
APPENDIX B - Minimum Electrical Clearance -
             Electrical Conductor Spacing
APPENDIX C - J-STD-001 Guidance on
             Objective Evidence of Material Compatibility
APPENDIX D - Cross Reference Listing
             by Revision
ACRONYM INDEX

Describes the J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies (Standard) and is intended to provide supporting information.

DevelopmentNote
Supplements J STD 001. (02/2002) Included in IPC C 103. (04/2013) Also available in Hardcopy format. (01/2018)
DocumentType
Standard
Pages
100
PublisherName
IPC by Global Electronics Association
Status
Superseded
SupersededBy
Supersedes

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A newer version of this standard is available.

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