IPC HDBK 001 : E
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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HANDBOOK AND GUIDE TO SUPPLEMENT J-STD-001
Available format(s)
PDF
Language(s)
English
Publisher
Superseded date
07-05-2021
Superseded by
Excluding VAT
0.1 GENERAL
0.2 FORMAT (Using This Handbook)
1 GENERAL
2 APPLICABLE DOCUMENTS
3 MATERIAL, COMPONENTS, AND EQUIPMENT
REQUIREMENTS
4 GENERAL SOLDERING AND ASSEMBLY
REQUIREMENTS
5 WIRES AND TERMINAL CONNECTIONS
6 THROUGH-HOLE MOUNTING AND
TERMINATIONS
7 SURFACE MOUNTING OF COMPONENTS
8 CLEANING PROCESS REQUIREMENTS
9 PCB REQUIREMENTS
10 COATING, ENCAPSULATION AND STAKING
(ADHESIVE)
11 WITNESS (TORQUE/ANTI-TAMPERING)
STRIPE
12 PRODUCT ASSURANCE
13 REWORK AND REPAIR
APPENDIX GUIDE
APPENDIX A - Guidelines for Soldering Tools
and Equipment
APPENDIX B - Minimum Electrical Clearance -
Electrical Conductor Spacing
APPENDIX C - J-STD-001 Guidance on
Objective Evidence of Material Compatibility
APPENDIX D - Cross Reference Listing
by Revision
ACRONYM INDEX
Describes the J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies (Standard) and is intended to provide supporting information.
| DevelopmentNote |
Supplements J STD 001. (02/2002) Included in IPC C 103. (04/2013) Also available in Hardcopy format. (01/2018)
|
| DocumentType |
Standard
|
| Pages |
100
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| IPC PD 335 : 1989 | ELECTRONIC PACKAGING HANDBOOK |
| BS EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies |
| EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| IPC 6012 RUSSIAN : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC J STD 001 SWEDISH : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 001 RUSSIAN : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC 9501 : 0 | PWB ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF ELECTRONIC COMPONENTS (PRECONDITIONING IC COMPONENTS) |
| IPC J STD 001 TURKISH : E2010 | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 001 POLISH : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC TA 722 : 1990 | TECHNOLOGY ASSESSMENT HANDBOOK ON SOLDERING |
| IPC 1601 GERMAN : - | PRINTED BOARD HANDLING AND STORAGE GUIDELINES |
| IPC 6012 POLISH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC D 279 : 0 | DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES |
| IPC TP 1090 : 1996 | THE LAYMAN'S GUIDE TO QUALIFYING NEW FLUXES FOR MIL-STD-2000A OR MT-0002 |
| IPC TR 549 : 1973 | MEASLES IN PRINTED WIRING BOARDS |
| IPC TA 723 : 1991 | TECHNOLOGY ASSESSMENT HANDBOOK ON SURFACE MOUNTING |
| IPC A 610 HINDI : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC 9502 : 0 | PWB ASSEMBLY SOLDERING PROCESS GUIDELINE FOR ELECTRONIC COMPONENTS |
| IPC 5702 : 0 | GUIDELINES FOR OEMS IN DETERMINING ACCEPTABLE LEVELS OF CLEANLINESS OF UNPOPULATED PRINTED BOARDS |
| IPC 9500 : 2003 | ASSEMBLY PROCESS COMPONENT SIMULATIONS, GUIDELINES & CLASSIFICATIONS PACKAGE |
| IPC 9504 : 0 | ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF NON-IC COMPONENTS (PRECONDITIONING NON-IC COMPONENTS) |
| IPC 7530 HUNGARIAN : - | GUIDELINES FOR TEMPERATURE PROFILING FOR MASS SOLDERING (REFLOW AND WAVE) PROCESSES |
| IPC A 610 ESTONIAN : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 DUTCH : F2014 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC FA 251 : 0 | GUIDELINES FOR ASSEMBLY OF SINGLE- AND DOUBLE-SIDED FLEX CIRCUITS |
| IPC DPMO 202 : 2002 | IPC 7912/9261 END ITEM AND IN-PROCESS DPMO SET |
| IPC A 610 FRENCH : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC 5701 : 0 | USERS GUIDE FOR CLEANLINESS OF UNPOPULATED PRINTED BOARDS |
| IPC A 610 KOREAN : F2014 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC TR 467 : 0 | SUPPORTING DATA AND NUMERICAL EXAMPLES FOR J-STD-001 (CONTROL OF FLUXES) |
| IPC HDBK 830 : A | GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS |
| IPC J STD 001 HUNGARIAN : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 001 GERMAN : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC HDBK 610 : 0 | Handbook and Guide to IPC-A-610 (Includes IPC-A-610B to C Comparison) |
| IPC 7530 CHINESE : 2001 | GUIDELINES FOR TEMPERATURE PROFILING FOR MASS SOLDERING PROCESSES (REFLOW AND WAVE) |
| IPC TR 460 : A1984 | TROUBLE-SHOOTING CHECKLIST FOR WAVE SOLDERING PRINTED WIRING BOARDS |
| IPC HDBK 840 : 0 | SOLDER MASK HANDBOOK |
| IPC 6012 FRENCH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC A 610 CHINESE : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC TP 1114 : 1998 | THE LAYMAN'S GUIDE TO QUALIFYING A PROCESS TO J-STD-001B |
| IPC A 610 TURKISH : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC J STD 001 ROMANIAN : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 001 DANISH : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC A 610 RUSSIAN : D | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC TP 1115 : 1998 | SELECTION AND IMPLEMENTATION STRATEGY FOR A LOW-RESIDUE, NO-CLEAN PROCESS |
| SAE AS81703A | Connectors, Electric, Circular, Miniature, Rack and Panel or Push-Pull Coupling, Environment Resisting |
| IPC SA 61 : A | POST SOLDER SEMI-AQUEOUS CLEANING HANDBOOK |
| IPC J STD 001 CHINESE : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 001 SPANISH : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 001 FRENCH : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| ARINC 669 : 2004 | GUIDANCE FOR LEAD-BASED SOLDERING, REPAIR AND REWORK |
| NASA KSC E 165 : 2009 | ELECTRICAL GROUND SUPPORT EQUIPMENT FABRICATION, SPECIFICATION FOR |
| NASA STD 5005(INT) : 2007 | THE DESIGN AND FABRICATION OF GROUND SUPPORT EQUIPMENT |
| NASA KSC STD E 0001 : 2008 | DESIGN OF ELECTRICAL CONTROL AND MONITORING SYSTEMS, EQUIPMENT (GSE), AND PANELS, STANDARD FOR |
| IEC 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| IPC AC 62 : A | AQUEOUS POST SOLDER CLEANING HANDBOOK |
| IPC EA 100 K : 2001 | ELECTRONIC ASSEMBLY REFERENCE SET |
| IPC 1601 CHINESE : 2016 | PRINTED BOARD HANDLING AND STORAGE GUIDELINES |
| IPC SM 839 : 0 | PRE AND POST SOLDER MASK APPLICATION CLEANING GUIDELINES |
| IPC PE 740 : 0 | TROUBLESHOOTING FOR PRINTED BOARD MANUFACTURE AND ASSEMBLY |
| IPC SC 60 : A | POST SOLDER SOLVENT CLEANING HANDBOOK |
| IPC SM 782 : A1993 AMD 2 1999 | SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD |
| IPC 7721 : 1998 | REPAIR AND MODIFICATION OF PRINTED BOARDS AND ELECTRONIC ASSEMBLIES |
| IPC 9503 : 0 | MOISTURE SENSITIVITY CLASSIFICATION FOR NON-IC COMPONENTS |
| IPC M 104 : LATEST | STANDARDS FOR PRINTED BOARD ASSEMBLY MANUAL |
| IPC 7711 : 1998 | REWORK OF ELECTRONIC ASSEMBLIES |
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