IPC HM 860 : 0
Current
The latest, up-to-date edition.
SPECIFICATION FOR MULTILAYER HYBRID CIRCUITS
Hardcopy
English
01-01-1987
Important note : Users cannot be edited or removed once added to your Multi user PDF.Covers the qualification & performance requirements of multilayer circuits used in hybrid packaging. These circuits consist of 3 or more layers of conductor patterns separated from each other by insulating materials and interconnected by a continuous metallic interlayer connection. The substrate structure may include passive elements.
| DocumentType |
Standard
|
| Pages |
35
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| MIL-STD-2000 Revision A:1991 | STANDARD REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
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| IPC S 100 : LATEST | STANDARDS AND SPECIFICATIONS MANUAL |
| IPC E 500 : LATEST | IPC ELECTRONIC DOCUMENT COLLECTION |
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| IPC DD 135 : 0 | QUALIFICATION TESTING FOR DEPOSITED ORGANIC INTERLAYER DIELECTRIC MATERIALS FOR MULTICHIP MODULES |
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