IPC DD 135 : 0

Withdrawn

Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

QUALIFICATION TESTING FOR DEPOSITED ORGANIC INTERLAYER DIELECTRIC MATERIALS FOR MULTICHIP MODULES

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Withdrawn date: 23-07-2013

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Publisher: Institute of Printed Circuits

Table of Contents - (Show below) - (Hide below)

1 SCOPE
  1.1 Scope
  1.2 Purpose
  1.3 Classes
2 APPLICABLE DOCUMENTS
  2.1 IPC
  2.2 ASTM
3 PREPARATION FOR SPECIMENS FOR TEST
  3.1 Scope
  3.2 Specimen Configuration
  3.3 Precautions
  3.4 Apparatus
  3.5 Procedure
  3.6 Reporting of Specimen Processing History
4 MATERIAL PROPERTY TESTING AND REPORTING
  4.1 Notes
  4.2 Methods of Examination and Test
  4.3 Property Reporting
5 REFERENCES

Abstract - (Show below) - (Hide below)

Gives information about the deposited organic interlayer dielectric materials under evaluation for MCM-D applications. The standard and test methods have been written without bias towards any particular class of materials.

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Development Note	Also available in CD-ROM format. (09/2005)
Document Type	Standard
ISBN
Pages
Published
Publisher	Institute of Printed Circuits
Status	Withdrawn

Standards Referenced By This Book - (Show below) - (Hide below)

IPC HM 860 : 0	SPECIFICATION FOR MULTILAYER HYBRID CIRCUITS
IEC PAS 62250:2001	Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1)
IPC 6012 RUSSIAN : C	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC 6012 POLISH : C	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC 6012 FRENCH : C	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC 6013 GERMAN : B	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS
IPC D 859 : 0	DESIGN STANDARD FOR THICK FILM MULTILAYER HYBRID CIRCUITS
IPC 6015 : 0	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR ORGANIC MULTICHIP MODULE MOUNTING AND INTERCONNECTING STRUCTURES
IEC PAS 62249:2001	Qualification and performance specification for flexible printed boards

Standards Referencing This Book - (Show below) - (Hide below)

IPC S 100 : LATEST	STANDARDS AND SPECIFICATIONS MANUAL
IPC E 500 : LATEST	IPC ELECTRONIC DOCUMENT COLLECTION
IPC MC 790 : 0	GUIDELINES FOR MULTICHIP MODULE TECHNOLOGY UTILIZATION
IPC 4104 : 1999	SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) AND MICROVIA MATERIALS

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