IPC MC 324 : 1988
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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PERFORMANCE SPECIFICATIONS FOR METAL CORE BOARDS
23-07-2013
23-11-2012
NO CONTENTS SECTION
Establishes the qualification and performance requirements for a metal core packaging interconnection (P/I) structure, hereafter referred to as a metal core board. Metal core boards consist of at least one conductive pattern on each side of an insulated metal substrate. Interconnection between conductive patterns shall be made using plated-through holes. The metal substrate shall be an integral part of the metal core board prior to interconnecting the conductive pattern. The following specific topics are covered: product classifications; metal core board types; metal core insulating methods.
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Standard
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| PublisherName |
Institute of Printed Circuits
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| Status |
Superseded
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| SupersededBy |
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