Skip to content
Please enter a keyword to search

  • IPC 6012 : C

    View superseded by
    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
    View superseded by

    QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS

    Available format(s):  Hardcopy

    Superseded date:  15-08-2019

    Language(s):  English

    Published date: 

    Publisher:  Institute of Printed Circuits

    Add To Cart

    Table of Contents - (Show below) - (Hide below)

    1 SCOPE
    2 APPLICABLE DOCUMENTS
    3 REQUIREMENTS
    4 QUALITY ASSURANCE PROVISIONS
    5 NOTES
    APPENDIX A - Space and Military Avionics Class 3/A
                 Performance Requirements
    APPENDIX B

    Abstract - (Show below) - (Hide below)

    Describes the qualification and performance requirements for the fabrication of rigid printed boards.

    General Product Information - (Show below) - (Hide below)

    Committee D-30
    Development Note Supersedes IPC RB 276, IPC SC 320, IPC TC 500, IPC ML 950, IPC MC 324 & IPC ML 910. To be read in conjunction with IPC 6011. Included in IPC 6010 SERIES, IPC C 105 & IPC C 1000. Also available in CD-ROM format. C2010 Edition is still active in Polish & Russian Languages, See separate records. Also available in German, French, Spanish & Chinese Languages, See separate records. ADDENDUM 15 is available Separately, See seprate record IPC 6012DS. ADDENDUM 16 is available Separately See seprate record IPC 6012DA. Supersedes IPC 6016. (12/2016)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Superseded
    Superseded By
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    CSA C22.2 No. 60079-18 : 2016 EXPLOSIVE ATMOSPHERES - PART 18: EQUIPMENT PROTECTION BY ENCAPSULATION 'M'
    BS EN 60079-18 : 2015 EXPLOSIVE ATMOSPHERES - PART 18: EQUIPMENT PROTECTION BY ENCAPSULATION 'M'
    PD IEC/PAS 61249-8-1:2014 Qualification and performance of electrical insulating compound for printed wiring assemblies
    EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
    IPC 2222 GERMAN : A SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
    IPC 2222 FRENCH : A2010 SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
    IPC 4554 CHINESE : - SPECIFICATION FOR IMMERSION TIN PLATING FOR PRINTED CIRCUIT BOARDS
    IPC P-MICRO : 2010 PCB MULTI-ISSUE MICROSECTION WALL POSTER
    IPC AJ 820 : A ASSEMBLY AND JOINING HANDBOOK
    IPC J STD 001 SWEDISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC 4821 : 0 SPECIFICATION FOR EMBEDDED PASSIVE DEVICE CAPACITOR MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
    IPC A 43 : 1995 TEN-LAYER MULTILAYER ARTWORK
    IPC J STD 001 RUSSIAN : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 TURKISH : E2010 REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 POLISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC 2221 GERMAN : B GENERIC STANDARD ON PRINTED BOARD DESIGN
    IPC 1601 GERMAN : - PRINTED BOARD HANDLING AND STORAGE GUIDELINES
    IPC 7092 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR EMBEDDED COMPONENTS
    IPC 7093 CHINESE : - DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
    IPC 5704 : 0 CLEANLINESS REQUIREMENTS FOR UNPOPULATED PRINTED BOARDS
    IPC 2222 CHINESE : A SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
    IPC 4553 : A SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS
    IPC 9592 : B REQUIREMENTS FOR POWER CONVERSION DEVICES FOR THE COMPUTER AND TELECOMMUNICATIONS INDUSTRIES
    IPC 4761 : 0 DESIGN GUIDE FOR PROTECTION OF PRINTED BOARD VIA STRUCTURES
    IPC A 47 : 1996 COMPOSITE TEST PATTERN TEN-LAYER PHOTOTOOL
    IPC TR 486 : 0 ROUND ROBIN STUDY TO CORRELATE IST AND MICROSECTIONING EVALUATIONS FOR INNER-LAYER SEPARATION
    IPC 6010 SERIES : LATEST IPC-6010 QUALIFICATION AND PERFORMANCE SERIES
    IPC CH 65 : B GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES
    IPC DR 572 : A DRILLING GUIDELINES FOR PRINTED BOARDS
    IPC CH 65 CHINESE : B GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES
    IPC P-KD0508 : 2009 ABILITIES AND GAPS: IMAGE TRANSFER TECHNOLOGIES IN PWB FABRICATION
    IPC 2152 : 0 STANDARD FOR DETERMINING CURRENT CARRYING CAPACITY IN PRINTED BOARD DESIGN
    IPC J STD 001 HUNGARIAN : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC SM 840 : E QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
    IPC HDBK 830 : A GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS
    IPC J STD 001 GERMAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC SM 840 CHINESE : E QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
    IPC 4553 CHINESE : A SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS
    IPC HDBK 840 : 0 SOLDER MASK HANDBOOK
    IPC 7351 GERMAN : B Basic requirements for SMT design and SMD patch guideline
    IPC 1710 : A2004 OEM STANDARD FOR PRINTED BOARD MANUFACTURER'S QUALIFICATION PROFILE (MQP)
    IPC 4556 : 0 SPECIFICATION FOR ELECTROLESS NICKEL/ELECTROLESS PALLADIUM/IMMERSION GOLD (ENEPIG) PLATING FOR PRINTED CIRCUIT BOARDS
    IPC J STD 001 ROMANIAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 DANISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC A 42 : LATEST DOUBLE SIDED ARTWORK
    SAE AS 7119 : 2015 NADCAP AEROSPACE STANDARD FOR ELECTRONICS PRINTED CIRCUIT BOARDS
    BS EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
    PD IEC/TS 62647-1:2012 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan
    IPC 7351 : B GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
    13/30295427 DC : 0 BS IEC/PAS 61249-8-5 ED.1 - QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
    IPC J STD 001 CHINESE : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC 2222 : A SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
    IPC J STD 001 SPANISH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 FRENCH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC 7093 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
    IEC 60079-18:2014 RLV Explosive atmospheres - Part 18: Equipment protection by encapsulation “m”
    NASA KSC E 165 : 2009 ELECTRICAL GROUND SUPPORT EQUIPMENT FABRICATION, SPECIFICATION FOR
    NASA GSFC STD 6001 : 2016 CERAMIC COLUMN GRID ARRAY DESIGN AND MANUFACTURING RULES FOR FLIGHT HARDWARE
    NASA MSFC STD 2907 : 2006 WORKMANSHIP STANDARD FOR PRINTED WIRING BOARDS
    NASA STD 5005 : 2013 STANDARD FOR THE DESIGN AND FABRICATION OF GROUND SUPPORT EQUIPMENT
    NASA KSC DE 512-SM : 2012 FACILITY SYSTEMS, GROUND SUPPORT SYSTEMS, AND GROUND SUPPORT EQUIPMENT GENERAL DESIGN REQUIREMENTS
    GEIA STD 0005-1 : 2012 PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
    NASA JSC 20793 : 2017 CREWED SPACE VEHICLE BATTERY SAFETY REQUIREMENTS
    NASA JSC 27301 : 2009 MATERIALS AND PROCESSES SELECTION, CONTROL, AND IMPLEMENTATION PLAN FOR JSC FLIGHT HARDWARE
    IPC 4554 : 0 SPECIFICATION FOR IMMERSION TIN PLATING FOR PRINTED CIRCUIT BOARDS
    IEC TS 62647-1:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
    IEC PAS 61249-8-5:2014 Qualification and performance specification of permanent solder mask and flexible cover materials
    IEC PAS 62647-1:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management
    PD IEC/PAS 62647-1:2011 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management
    IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
    IEC TS 62647-22:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
    IEC PAS 62293:2001 Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016)
    13/30271432 DC : 0 BS EN 60079-18 ED 4.0 - EXPLOSIVE ATMOSPHERES - PART 18: EQUIPMENT PROTECTION BY ENCAPSULATION 'M'
    PD IEC/PAS 61249-8-5:2014 Qualification and performance specification of permanent solder mask and flexible cover materials
    EN 60079-18:2015/A1:2017 EXPLOSIVE ATMOSPHERES - PART 18: EQUIPMENT PROTECTION BY ENCAPSULATION 'M' (IEC 60079-18:2014/A1:2017)
    I.S. EN 60079-18:2015 EXPLOSIVE ATMOSPHERES - PART 18: EQUIPMENT PROTECTION BY ENCAPSULATION 'M'
    IPC 9703 : 0 IPC/JEDEC MECHANICAL SHOCK TEST GUIDELINES FOR SOLDER JOINT RELIABILITY
    IEC 60079-18 : 2014 REDLINE EXPLOSIVE ATMOSPHERES - PART 18: EQUIPMENT PROTECTION BY ENCAPSULATION 'M'
    IEC PAS 61249-8-1:2014 Qualification and performance of electrical insulating compound for printed wiring assemblies
    13/30295424 DC : 0 BS IEC/PAS 61249-8-1 ED.1 - QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES
    PD IEC/TS 62647-22:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines
    IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
    IPC 2221 FRENCH : B2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
    View more information

    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective