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IPC 6012 : C

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS

Available format(s)

Hardcopy

Superseded date

15-08-2019

Language(s)

English

1 SCOPE
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
4 QUALITY ASSURANCE PROVISIONS
5 NOTES
APPENDIX A - Space and Military Avionics Class 3/A
             Performance Requirements
APPENDIX B

Describes the qualification and performance requirements for the fabrication of rigid printed boards.

Committee
D-30
DevelopmentNote
Supersedes IPC RB 276, IPC SC 320, IPC TC 500, IPC ML 950, IPC MC 324 & IPC ML 910. To be read in conjunction with IPC 6011. Included in IPC 6010 SERIES, IPC C 105 & IPC C 1000. Also available in CD-ROM format. C2010 Edition is still active in Polish & Russian Languages, See separate records. Also available in German, French, Spanish & Chinese Languages, See separate records. ADDENDUM 15 is available Separately, See seprate record IPC 6012DS. ADDENDUM 16 is available Separately See seprate record IPC 6012DA. Supersedes IPC 6016. (12/2016)
DocumentType
Standard
Pages
60
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy
Supersedes

Standards Relationship
IEC PAS 62250:2001 Identical

CSA C22.2 No. 60079-18 : 2016 EXPLOSIVE ATMOSPHERES - PART 18: EQUIPMENT PROTECTION BY ENCAPSULATION 'M'
BS EN 60079-18 : 2015 EXPLOSIVE ATMOSPHERES - PART 18: EQUIPMENT PROTECTION BY ENCAPSULATION 'M'
PD IEC/PAS 61249-8-1:2014 Qualification and performance of electrical insulating compound for printed wiring assemblies
EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
IPC 2222 GERMAN : A SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
IPC 2222 FRENCH : A2010 SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
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IPC A 43 : 1995 TEN-LAYER MULTILAYER ARTWORK
IPC J STD 001 RUSSIAN : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 TURKISH : E2010 REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 POLISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
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IPC A 47 : 1996 COMPOSITE TEST PATTERN TEN-LAYER PHOTOTOOL
IPC TR 486 : 0 ROUND ROBIN STUDY TO CORRELATE IST AND MICROSECTIONING EVALUATIONS FOR INNER-LAYER SEPARATION
IPC 6010 SERIES : LATEST IPC-6010 QUALIFICATION AND PERFORMANCE SERIES
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IPC CH 65 CHINESE : B GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES
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IPC HDBK 830 : A GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS
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IPC SM 840 CHINESE : E QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
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IPC 7351 GERMAN : B Basic requirements for SMT design and SMD patch guideline
IPC 1710 : A2004 OEM STANDARD FOR PRINTED BOARD MANUFACTURER'S QUALIFICATION PROFILE (MQP)
IPC 4556 : 0 SPECIFICATION FOR ELECTROLESS NICKEL/ELECTROLESS PALLADIUM/IMMERSION GOLD (ENEPIG) PLATING FOR PRINTED CIRCUIT BOARDS
IPC J STD 001 ROMANIAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
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IPC A 42 : LATEST DOUBLE SIDED ARTWORK
SAE AS 7119 : 2015 NADCAP AEROSPACE STANDARD FOR ELECTRONICS PRINTED CIRCUIT BOARDS
BS EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
PD IEC/TS 62647-1:2012 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan
IPC 7351 : B GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
13/30295427 DC : 0 BS IEC/PAS 61249-8-5 ED.1 - QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
IPC J STD 001 CHINESE : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC 2222 : A SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
IPC J STD 001 SPANISH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 FRENCH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC 7093 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
IEC 60079-18:2014 RLV Explosive atmospheres - Part 18: Equipment protection by encapsulation “m”
NASA KSC E 165 : 2009 ELECTRICAL GROUND SUPPORT EQUIPMENT FABRICATION, SPECIFICATION FOR
NASA GSFC STD 6001 : 2016 CERAMIC COLUMN GRID ARRAY DESIGN AND MANUFACTURING RULES FOR FLIGHT HARDWARE
NASA MSFC STD 2907 : 2006 WORKMANSHIP STANDARD FOR PRINTED WIRING BOARDS
NASA STD 5005 : 2013 STANDARD FOR THE DESIGN AND FABRICATION OF GROUND SUPPORT EQUIPMENT
NASA KSC DE 512-SM : 2012 FACILITY SYSTEMS, GROUND SUPPORT SYSTEMS, AND GROUND SUPPORT EQUIPMENT GENERAL DESIGN REQUIREMENTS
GEIA STD 0005-1 : 2012 PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
NASA JSC 20793 : 2017 CREWED SPACE VEHICLE BATTERY SAFETY REQUIREMENTS
NASA JSC 27301 : 2009 MATERIALS AND PROCESSES SELECTION, CONTROL, AND IMPLEMENTATION PLAN FOR JSC FLIGHT HARDWARE
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IEC TS 62647-1:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
IEC PAS 61249-8-5:2014 Qualification and performance specification of permanent solder mask and flexible cover materials
IEC PAS 62647-1:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management
PD IEC/PAS 62647-1:2011 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management
IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
IEC TS 62647-22:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
IEC PAS 62293:2001 Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016)
13/30271432 DC : 0 BS EN 60079-18 ED 4.0 - EXPLOSIVE ATMOSPHERES - PART 18: EQUIPMENT PROTECTION BY ENCAPSULATION 'M'
PD IEC/PAS 61249-8-5:2014 Qualification and performance specification of permanent solder mask and flexible cover materials
EN 60079-18:2015/A1:2017 EXPLOSIVE ATMOSPHERES - PART 18: EQUIPMENT PROTECTION BY ENCAPSULATION 'M' (IEC 60079-18:2014/A1:2017)
I.S. EN 60079-18:2015 EXPLOSIVE ATMOSPHERES - PART 18: EQUIPMENT PROTECTION BY ENCAPSULATION 'M'
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IEC 60079-18 : 2014 REDLINE EXPLOSIVE ATMOSPHERES - PART 18: EQUIPMENT PROTECTION BY ENCAPSULATION 'M'
IEC PAS 61249-8-1:2014 Qualification and performance of electrical insulating compound for printed wiring assemblies
13/30295424 DC : 0 BS IEC/PAS 61249-8-1 ED.1 - QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES
PD IEC/TS 62647-22:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines
IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 2221 FRENCH : B2012 GENERIC STANDARD ON PRINTED BOARD DESIGN

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