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IPC 6011 : 0

Current

Current

The latest, up-to-date edition.

GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS

Published date

01-07-1996

1.0 SCOPE
     1.1 Statement of Scope
     1.2 Performance Classes
     1.3 Dimensions and Tolerances
     1.4 Interpretation
     1.5 Contractual Agreements
2.0 APPLICABLE DOCUMENTS
     2.1 IPC
     2.2 International Standards Organization
3.0 REQUIREMENTS
     3.1 General
     3.2 Terms and Definitions
     3.3 Printed Board Detail Requirements
     3.4 Deviations and Waivers
     3.5 Order of Precedence
     3.6 Qualification Assessment
     3.7 Quality Assurance Program
     3.8 Material
4.0 QUALITY ASSURANCE PROVISIONS
     4.1 Responsibility for Inspection
     4.2 Materials Inspection
     4.3 Quality Conformance Inspection
     4.4 Reliability Test and Evaluation
5.0 PREPARATION FOR DELIVERY
     5.1 Packaging
6.0 NOTES
     6.1 Statistical Process Control (SPC)
APPENDIX A
Tables

Establishes the general requirements and responsibilities for suppliers and users of printed boards. Describes quality and reliability assurance requirements that must be met for their acquisition. For use with IPC-6012.

DevelopmentNote
To be used with IPC 6012 through IPC 6018. Supersedes IPC RB 276, IPC SC 320, IPC TC 500, IPC ML 950 and IPC MC 324. Also available in German Language, See IPC 6011 GERMAN. Included in IPC 6010 SERIES, IPC C 102, IPC C 105 & IPC C 1000. (07/2009) Also available in Chinese Language, See IPC 6011 CHINESE. (11/2011)
DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Current
Supersedes

Standards Relationship
IEC PAS 62214:2001 Identical

IEC PAS 62250:2001 Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1)
IPC J STD 001 SWEDISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC 6012 RUSSIAN : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC A 43 : 1995 TEN-LAYER MULTILAYER ARTWORK
IPC J STD 001 RUSSIAN : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 TURKISH : E2010 REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 POLISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC 9191 : 0 GENERAL GUIDELINES FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC)
IPC 2221 GERMAN : B GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 6012 POLISH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC 4553 : A SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS
IPC 2524 : 0 PWB FABRICATION DATA QUALITY RATING SYSTEM
IPC 6010 SERIES : LATEST IPC-6010 QUALIFICATION AND PERFORMANCE SERIES
IPC P-KD0508 : 2009 ABILITIES AND GAPS: IMAGE TRANSFER TECHNOLOGIES IN PWB FABRICATION
IPC J STD 001 HUNGARIAN : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 GERMAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC 4553 CHINESE : A SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS
IPC HDBK 840 : 0 SOLDER MASK HANDBOOK
IPC 6012 FRENCH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC 4556 : 0 SPECIFICATION FOR ELECTROLESS NICKEL/ELECTROLESS PALLADIUM/IMMERSION GOLD (ENEPIG) PLATING FOR PRINTED CIRCUIT BOARDS
IPC 6013 GERMAN : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS
IPC J STD 001 ROMANIAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 DANISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC 6018 CHINESE : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD
IPC 9199 : 0 STATISTICAL PROCESS CONTROL (SPC) QUALITY RATING
IPC J STD 001 CHINESE : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 SPANISH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 FRENCH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
NASA KSC E 165 : 2009 ELECTRICAL GROUND SUPPORT EQUIPMENT FABRICATION, SPECIFICATION FOR
NASA STD 5005 : 2013 STANDARD FOR THE DESIGN AND FABRICATION OF GROUND SUPPORT EQUIPMENT
GEIA TA HB 0009 : 2013 RELIABILITY PROGRAM HANDBOOK
NASA KSC DE 512-SM : 2012 FACILITY SYSTEMS, GROUND SUPPORT SYSTEMS, AND GROUND SUPPORT EQUIPMENT GENERAL DESIGN REQUIREMENTS
NASA JSC 27301 : 2009 MATERIALS AND PROCESSES SELECTION, CONTROL, AND IMPLEMENTATION PLAN FOR JSC FLIGHT HARDWARE
IEC TS 62647-22:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
IEC PAS 62293:2001 Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016)
IEC PAS 62249:2001 Qualification and performance specification for flexible printed boards
IPC 9708 : 0 TEST METHODS FOR CHARACTERIZATION OF PRINTED BOARD ASSEMBLY PAD CRATERING
IPC 9708 CHINESE : - TEST METHODS FOR CHARACTERIZATION OF PRINTED BOARD ASSEMBLY PAD CRATERING
PD IEC/TS 62647-22:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines
IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 2221 FRENCH : B2012 GENERIC STANDARD ON PRINTED BOARD DESIGN

IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IPC 1710 : A2004 OEM STANDARD FOR PRINTED BOARD MANUFACTURER'S QUALIFICATION PROFILE (MQP)
IPC PC 1990 : 1990 GENERAL REQUIREMENTS FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL
ISO 9000:2015 Quality management systems — Fundamentals and vocabulary
IPC QL 653 : A Certification of Facilities that Inspect/Test Printed Boards, Components & Materials

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