IPC 6011 : 0
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS
Hardcopy , PDF
English
01-07-1996
25-02-2025
1.0 SCOPE
1.1 Statement of Scope
1.2 Performance Classes
1.3 Dimensions and Tolerances
1.4 Interpretation
1.5 Contractual Agreements
2.0 APPLICABLE DOCUMENTS
2.1 IPC
2.2 International Standards Organization
3.0 REQUIREMENTS
3.1 General
3.2 Terms and Definitions
3.3 Printed Board Detail Requirements
3.4 Deviations and Waivers
3.5 Order of Precedence
3.6 Qualification Assessment
3.7 Quality Assurance Program
3.8 Material
4.0 QUALITY ASSURANCE PROVISIONS
4.1 Responsibility for Inspection
4.2 Materials Inspection
4.3 Quality Conformance Inspection
4.4 Reliability Test and Evaluation
5.0 PREPARATION FOR DELIVERY
5.1 Packaging
6.0 NOTES
6.1 Statistical Process Control (SPC)
APPENDIX A
Tables
Establishes the general requirements and responsibilities for suppliers and users of printed boards. Describes quality and reliability assurance requirements that must be met for their acquisition. For use with IPC-6012.
| DevelopmentNote |
To be used with IPC 6012 through IPC 6018. Supersedes IPC RB 276, IPC SC 320, IPC TC 500, IPC ML 950 and IPC MC 324. Also available in German Language, See IPC 6011 GERMAN. Included in IPC 6010 SERIES, IPC C 102, IPC C 105 & IPC C 1000. (07/2009) Also available in Chinese Language, See IPC 6011 CHINESE. (11/2011)
|
| DocumentType |
Standard
|
| Pages |
23
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| IEC PAS 62214:2001 | Identical |
| IEC PAS 62250:2001 | Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1) |
| IPC 4553 : A | SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS |
| NASA KSC E 165 : 2009 | ELECTRICAL GROUND SUPPORT EQUIPMENT FABRICATION, SPECIFICATION FOR |
| NASA STD 5005 : 2013 | STANDARD FOR THE DESIGN AND FABRICATION OF GROUND SUPPORT EQUIPMENT |
| GEIA TA HB 0009 : 2013 | RELIABILITY PROGRAM HANDBOOK |
| NASA KSC DE 512-SM : 2012 | FACILITY SYSTEMS, GROUND SUPPORT SYSTEMS, AND GROUND SUPPORT EQUIPMENT GENERAL DESIGN REQUIREMENTS |
| NASA JSC 27301 : 2009 | MATERIALS AND PROCESSES SELECTION, CONTROL, AND IMPLEMENTATION PLAN FOR JSC FLIGHT HARDWARE |
| IEC TS 62647-22:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
| IEC PAS 62293:2001 | Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016) |
| IEC PAS 62249:2001 | Qualification and performance specification for flexible printed boards |
| IPC 9708 : 0 | TEST METHODS FOR CHARACTERIZATION OF PRINTED BOARD ASSEMBLY PAD CRATERING |
| PD IEC/TS 62647-22:2013 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| ISO 9000:2015 | Quality management systems — Fundamentals and vocabulary |