IPC MF 150 : F AMD 1
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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METAL FOIL FOR PRINTED WIRING APPLICATIONS
Amendment of
Published date
23-11-2012
Publisher
Superseded date
01-05-2000
Superseded by
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Covers unsupported electrodeposited copper foil, aluminum or copper carrier supported electrodeposited copper foil and wrought copper foil suitable for subsequent use in printed boards. The following topics are covered: functional classes; copper weight; bonding treatment. AMD 1 IS AVAILABLE FROM IPC FOR #15.13
| DevelopmentNote |
Supersedes IPC FC 150 (07/2004)
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| DocumentType |
Standard
|
| PublisherName |
IPC by Global Electronics Association
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| Status |
Superseded
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| SupersededBy |
| MIL P 13949 : G (1) SUPP 1 | SHEET, PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR |
| QQ-S-571 Revision F:1994 | SOLDER, ELECTRONIC (96 TO 485 DEG. C) (S/S BY J-STD-004, J-STD-005 AND J-STD-006) |
| I.S. EN 16602-70-11:2015 | SPACE PRODUCT ASSURANCE - PROCUREMENT OF PRINTED CIRCUIT BOARDS |
| IPC 7095 : C | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
| MIL-PRF-26514 Revision G:1995 | Polyurethane Foam, Rigid or Flexible, for Packaging |
| MIL-S-13949 Revision H:1993 | SHEET, PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR (NO S/S DOCUMENT) |
| IEC PAS 62249:2001 | Qualification and performance specification for flexible printed boards |
| EN 16602-70-11:2015 | Space product assurance - Procurement of printed circuit boards |
| IPC L 112 : A92 | SPECIFICATION FOR COMPOSITE METAL CLAD BASE MATERIALS FOR PRINTED BOARDS |
| IPC FC 232 : C1994 AMD 1 1995 | ADHESIVE COATED DIELECTRIC FILMS FOR USE AS COVER SHEETS FOR FLEXIBLE PRINTED WIRING AND FLEXIBLE BONDING FILMS |
| BS EN 16602-70-11:2015 | Space product assurance. Procurement of printed circuit boards |
| IPC L 125 : A | Specification for Plastic Substrates Clad or Unclad for High Speed/High Frequency Interconnections |
Summarise
Sorry this product is not available in your region.