IPC FC 241 : C1992 AMD 1 1995
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
FLEXIBLE METAL CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED WIRING
23-11-2012
01-05-2002
NO CONTENTS SECTION
Establishes the requirement for flexible metal-clad dielectrics to be used for the fabrication of flexible printed wiring. The following topics are covered: base material; types of reinforcement; types of metal foil; methods of reinforcement; types of adhesive; bond enhancement; product classification; quality classification; military standards; applicable documents; underwriters laboratories standards; environmental requirements. Also contains detailed tables and diagrams.
| DevelopmentNote |
D99 (PROPOSAL) is an official representative proposal (draft only). (07/2002)
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| DocumentType |
Standard
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| PublisherName |
IPC by Global Electronics Association
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| Status |
Superseded
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| SupersededBy | |
| Supersedes |
| IPC FC 250 : A1986 | SPECIFICATION FOR SINGLE AND DOUBLE-SIDED FLEXIBLE PRINTED WIRING |
| IPC A 31 : LATEST | FLEXIBLE RAW MATERIAL TEST PATTERN - FILM FORMAT |
| IEC PAS 62293:2001 | Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016) |
| IEC PAS 62249:2001 | Qualification and performance specification for flexible printed boards |
| IPC RF 245 : 1987 | RIGID-FLEX PRINTED BOARDS, PERFORMANCE SPECIFICATION FOR, |
| IPC MC 324 : 1988 | PERFORMANCE SPECIFICATIONS FOR METAL CORE BOARDS |
| IPC FC 232 : C1994 AMD 1 1995 | ADHESIVE COATED DIELECTRIC FILMS FOR USE AS COVER SHEETS FOR FLEXIBLE PRINTED WIRING AND FLEXIBLE BONDING FILMS |
| MIL-STD-2118 Base Document:1984 | Flexible and Rigid Flex Printed Wiring for Electronic Equipment Design Requirements for (S/S by IPC2221 and IPC2223) |
| IPC FC 231 : C1992 AMD 1 1995 | FLEXIBLE BARE DIELECTRICS FOR USE IN FLEXIBLE PRINTED WIRING |
| IPC FC 240 : B1974 | SPECIFICATION FOR SINGLE-SIDED FLEXIBLE PRINTED WIRING |
| IPC M 102 : LATEST | FLEXIBLE CIRCUITS COMPENDIUM |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| MIL-STD-45662 Revision A:1988 | Calibration Systems Requirements (Refer to ISO-10012-1 and ANSI-Z540-1 or Comparable Standards as Alternatives to MIL-STD-45662) |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| IPC PC 1990 : 1990 | GENERAL REQUIREMENTS FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL |
| MIL-STD-414 Base Document:1957 | SAMPLING PROCEDURE AND TABLE FOR INSPECTION BY VARIABLES FOR PERCENT DEFECTIVE (S/S BY ASQC-Z1.9) |
| IPC FC 232 : C1994 AMD 1 1995 | ADHESIVE COATED DIELECTRIC FILMS FOR USE AS COVER SHEETS FOR FLEXIBLE PRINTED WIRING AND FLEXIBLE BONDING FILMS |
| IPC FC 231 : C1992 AMD 1 1995 | FLEXIBLE BARE DIELECTRICS FOR USE IN FLEXIBLE PRINTED WIRING |
| IPC MF 150 : F AMD 1 | METAL FOIL FOR PRINTED WIRING APPLICATIONS |
| MIL-STD-202 Revision H:2015 | Electronic and Electrical Component Parts |
| MIL-STD-105 Revision E:1989 | Sampling Procedures and Tables for Inspection by Attributes (See Notice 3 for Replacement Information) |
| ASTM D 374 : 1999 | Standard Test Methods for Thickness of Solid Electrical Insulation |