Aggregate of information prepared by the Product Assurance Committee of the IPC. Pertains to suggested procedures for modifying and repairing printed boards. Procedure details have been obtained from printed board manufacturers and users who have recognized the need for documenting commonly used modification & repair techniques that have proven to be acceptable through testing and extended field functionability. In selecting an appropriate method, the economics of time, labor, material, and procedure limitations should be weighed against outright board assembly replacement.