• IPC 7711 : 1998

    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

    REWORK OF ELECTRONIC ASSEMBLIES

    Available format(s): 

    Superseded date:  01-10-2003

    Language(s): 

    Published date:  12-01-2013

    Publisher:  Institute of Printed Circuits

    Sorry this product is not available in your region.

    Add To Cart

    Table of Contents - (Show below) - (Hide below)

    1 General
    2 Handling/Cleaning
      2.1 Handling Electronic Assemblies
      2.2 Cleaning
      2.3 Conditioning
      2.4 Coating
    3 Removal
      3.1 Through-Hole Removal
      3.2 PGA and Connector Removal
      3.3 Chip Component Removal
      3.4 Leadless Component removal
      3.5 SOT Removal
      3.6 Gull Wing Removal (two sided)
      3.7 Gull Wing Removal (four sided)
      3.8 J-Lead Removal
      3.9 BGA/CSP Removal
      3.10 PLCC Socket Removal
    4 Pad/Land Preparation
    5 Installation
      5.1 Through-Hole Installation
      5.2 PGA and Connector Installation
      5.3 Chip Installation
      5.4 Leadless Component Installation
      5.5 Gull Wing Installation
      5.6 J-Lead Installation
      5.7 BGA-CSP Installation
    6 Removing Shorts
    7 Bonding/Coating
    8 Wires
      8.1 Splicing

    Abstract - (Show below) - (Hide below)

    Gives procedures for reworking electronic assemblies, either once the assemblies have been in the field or as part of the manufacturing process. The procedural requirements for materials, tools and methods used in replacing and removing conformal coatings, through-hole components and surface mounts are prescribed.

    General Product Information - (Show below) - (Hide below)

    Development Note Supersedes IPC R 700. (08/1998) This document is included in IPC 7711/21 (7711 AND 7721 PACKAGE) (06/2002) Included in the E-500 Collection. (09/2003)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Superseded
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS EN 61192-5 : 2007 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
    I.S. EN 61192-5:2007 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
    ARINC 669 : 2004 GUIDANCE FOR LEAD-BASED SOLDERING, REPAIR AND REWORK
    ARINC 671 : 2006 GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR
    GEIA HB 0005-3 : 2008 REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
    IEC 61192-5:2007 Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
    IEC PAS 62249:2001 Qualification and performance specification for flexible printed boards
    EN 61192-5 : 2007 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective