IPC 7711 : 1998

Superseded

Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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REWORK OF ELECTRONIC ASSEMBLIES

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Superseded date: 01-10-2003

Language(s):

Published date: 12-01-2013

Publisher: Institute of Printed Circuits

Table of Contents - (Show below) - (Hide below)

1 General
2 Handling/Cleaning
  2.1 Handling Electronic Assemblies
  2.2 Cleaning
  2.3 Conditioning
  2.4 Coating
3 Removal
  3.1 Through-Hole Removal
  3.2 PGA and Connector Removal
  3.3 Chip Component Removal
  3.4 Leadless Component removal
  3.5 SOT Removal
  3.6 Gull Wing Removal (two sided)
  3.7 Gull Wing Removal (four sided)
  3.8 J-Lead Removal
  3.9 BGA/CSP Removal
  3.10 PLCC Socket Removal
4 Pad/Land Preparation
5 Installation
  5.1 Through-Hole Installation
  5.2 PGA and Connector Installation
  5.3 Chip Installation
  5.4 Leadless Component Installation
  5.5 Gull Wing Installation
  5.6 J-Lead Installation
  5.7 BGA-CSP Installation
6 Removing Shorts
7 Bonding/Coating
8 Wires
  8.1 Splicing

Abstract - (Show below) - (Hide below)

Gives procedures for reworking electronic assemblies, either once the assemblies have been in the field or as part of the manufacturing process. The procedural requirements for materials, tools and methods used in replacing and removing conformal coatings, through-hole components and surface mounts are prescribed.

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Development Note	Supersedes IPC R 700. (08/1998) This document is included in IPC 7711/21 (7711 AND 7721 PACKAGE) (06/2002) Included in the E-500 Collection. (09/2003)
Document Type	Standard
ISBN
Pages
Published
Publisher	Institute of Printed Circuits
Status	Superseded
Superseded By	IPC 7711/21 : B
Supersedes	IPC R 700 : C1988

Standards Referenced By This Book - (Show below) - (Hide below)

IPC D 326 : A	INFORMATION REQUIREMENTS FOR MANUFACTURING PRINTED CIRCUIT BOARDS AND OTHER ELECTRONIC ASSEMBLIES
IPC J STD 033 RUSSIAN : B	HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE MOUNT DEVICES
IPC J STD 033 CHINESE : B-1	HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE MOUNT DEVICES
IPC J STD 033 GERMAN : C	HANDLING, PACKING, SHIPPING, AND USE OF MOISTURE/REFLOW AND/OR PROCESS SENSITIVE COMPONENTS
IPC J STD 033 ITALIAN : B	HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE MOUNT DEVICES
ARINC 669 : 2004	GUIDANCE FOR LEAD-BASED SOLDERING, REPAIR AND REWORK
GEIA HB 0005-3 : 2008	REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
ARINC 671 : 2006	GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR
IEC 61192-5:2007	Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
IEC PAS 62249:2001	Qualification and performance specification for flexible printed boards
BS EN 61192-5:2007	Workmanship requirements for soldered electric assemblies Rework, modification and repair of soldered electronic assemblies
I.S. EN 61192-5:2007	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
EN 61192-5 : 2007	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES

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