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IPC S 815 : B1987

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

GENERAL REQUIREMENTS FOR SOLDERING OF ELECTRONIC INTERCONNECTIONS

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

23-11-2012

Withdrawn date

13-09-2023

Prescribes general requirements for high-quality soldering of electronic interconnections. (Processes are restricted to those soldering alloys having liquidus temperatures below 427 degrees C (800 degrees F). Defines the approved materials, methods, and inspection criteria for producing the quality of electrical soldering workmanship necessary for soldering of electrical connection and printed board assemblies. Recognizes that an assembly with soldered electrical interconnection will be subject to classification by intended end item use. Toward this end, recommended classes for assembly, flux and cleanliness have been established in this document.

DocumentType
Standard
Pages
48
PublisherName
IPC by Global Electronics Association
Status
Withdrawn

MIL P 28809 : A PRINTED WIRING ASSEMBLIES
MIL-C-28809 Revision B:1988 Circuit Card Assemblies, Rigid, Flexible, And Rigid Flex (No S/S Document)
MIL-PRF-49404 Revision A:1997 Bias Voltage Regulator, CN-1559/UA (No S/S Document)
MIL-PRF-49177 Revision B:1997 Scan Interlace PL-1408/UA
MIL-PRF-49176 Revision B:1997 Regulator, Bias Voltage, CN-1503/UA (No S/S Document)
IPC SP 819 : 1988 SPECIFICATION FOR SOLDER PASTES
MIL-STD-2118 Base Document:1984 Flexible and Rigid Flex Printed Wiring for Electronic Equipment Design Requirements for (S/S by IPC2221 and IPC2223)
MIL-PRF-49164 Revision C:1997 Video Postamplifier-Control Driver, AM-6924/UA (No S/S Document)
MIL-PRF-49166 Revision C:1999 Mechanical Scanner, MX-9872(V)/UA; General Specification for (No S/S Document)

IPC A 600 : H ACCEPTABILITY OF PRINTED BOARDS
IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IPC SM 780 : 0 COMPONENT PACKAGING AND INTERCONNECTING WITH EMPHASIS ON SURFACE MOUNTING
IPC TM 650 : 0 TEST METHODS MANUAL
IPC A 610 : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC CM 770 : E COMPONENT MOUNTING GUIDELINES FOR PRINTED BOARDS
IPC SF 818 : 1991 GENERAL REQUIREMENTS FOR ELECTRONIC SOLDERING FLUXES
IPC TR 460 : A1984 TROUBLE-SHOOTING CHECKLIST FOR WAVE SOLDERING PRINTED WIRING BOARDS
IPC SP 819 : 1988 SPECIFICATION FOR SOLDER PASTES
IPC AJ 820 : A ASSEMBLY AND JOINING HANDBOOK