IPC-TM-650-MDP-A:2020
Current
Current
The latest, up-to-date edition.
IPC Test Method Development Packet
Available format(s)
Hardcopy
Language(s)
English
Published date
06-06-2012
Publisher
This packet defines the elements that shall be included in an IPC-TM-650 Test Method and used to assist the IPC 7-11 Test Methods Subcommittee (TMSC) in their reviewing process.
| DocumentType |
Test Method
|
| Pages |
14
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| Supersedes |
| CEI EN IEC 61189-2-804:2024 | Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300 |
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