IPC TR 486 : 0
Current
Current
The latest, up-to-date edition.
ROUND ROBIN STUDY TO CORRELATE IST AND MICROSECTIONING EVALUATIONS FOR INNER-LAYER SEPARATION
Available format(s)
Hardcopy
Language(s)
English
Published date
01-07-2001
Publisher
Provides full detail of the round study charged with assessing the use of IST as a test for incoming inspection in lieu of Thermal Stress in the detection of innerlayer separations in plated-through holes.
| DevelopmentNote |
Included in IPC C 105 & IPC C 1000. (08/2008)
|
| DocumentType |
Standard
|
| Pages |
15
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| IPC A 600 : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC 6012 : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
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