ISO 9455-17:2002
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
View Superseded by
Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues
Hardcopy , PDF
English, French
09-12-2002
09-04-2025
ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders.
This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.
| Committee |
ISO/TC 44/SC 12
|
| DevelopmentNote |
Supersedes ISO/DIS 9455-17 (12/2002)
|
| DocumentType |
Standard
|
| Pages |
21
|
| PublisherName |
International Organization for Standardization
|
| Status |
Withdrawn
|
| SupersededBy | |
| UnderRevision |
| Standards | Relationship |
| NBN EN ISO 9455-17 : 2006 | Identical |
| NEN EN ISO 9455-17 : 2006 | Identical |
| NS EN ISO 9455-17 : 1ED 2006 | Identical |
| I.S. EN ISO 9455-17:2006 | Identical |
| PN EN ISO 9455-17 : 2006 | Identical |
| BS ISO 9455-17 : 2002 AMD 16425 | Identical |
| BS EN ISO 9455-17:2006 | Identical |
| EN ISO 9455-17:2006 | Identical |
| NF EN ISO 9455-17 : 2006 | Identical |
| DIN EN ISO 9455-17:2006-09 | Identical |
| ONORM EN ISO 9455-17 : 2006 | Identical |
| DS EN ISO 9455-17 : 2006 | Identical |
| UNE-EN ISO 9455-17:2007 | Identical |
| BS EN ISO 12224-1:1998 | Solder wire, solid and flux cored. Specification and test methods Classification and performance requirements |
| I.S. EN ISO 9454-2:2000 | SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 2: PERFORMANCE REQUIREMENTS |
| IEC TR 62866:2014 | Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing |
| 12/30254694 DC : DRAFT MAR 2012 | BS ISO 16525-8 - ADHESIVES - TEST METHODS FOR ISOTROPICALLY ELECTRICALLY CONDUCTING ADHESIVES - PART 8: ELECTROCHEMICAL-MIGRATION TEST METHODS |
| PD IEC/TR 62866:2014 | Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing |
| NF EN ISO 9454-2 : 2000 | SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 2: PERFORMANCE REQUIREMENTS |
| EN ISO 12224-1:1998 | Solder wire, solid and flux cored - Specification and test methods - Part 1: Classification and performance requirements (ISO 12224-1:1997) |
| BS ISO 16525-8:2014 | Adhesives. Test methods for isotropic electrically conductive adhesives Electrochemical-migration test methods |
| ISO 16525-8:2014 | Adhesives — Test methods for isotropic electrically conductive adhesives — Part 8: Electrochemical-migration test methods |
| NF EN ISO 12224-1 : 1998 | SOLDER WIRE, SOLID AND FLUX CORED - SPECIFICATION AND TEST METHODS - PART 1: CLASSIFICATION AND PERFORMANCE REQUIREMENTS |
| I.S. EN ISO 12224-1:1999 | SOLDER WIRE, SOLID AND FLUX CORED - SPECIFICATION AND TEST METHODS - CLASSIFICATION AND PERFORMANCE REQUIREMENTS |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 61249-2-7:2002 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad |
| ISO 9454-1:2016 | Soft soldering fluxes — Classification and requirements — Part 1: Classification, labelling and packaging |
| ISO 5725-2:1994 | Accuracy (trueness and precision) of measurement methods and results — Part 2: Basic method for the determination of repeatability and reproducibility of a standard measurement method |
| ISO 9453:2014 | Soft solder alloys — Chemical compositions and forms |
| ISO 12224-1:1997 | Solder wire, solid and flux cored — Specification and test methods — Part 1: Classification and performance requirements |
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