ISO/IEC 14575:2000
Current
The latest, up-to-date edition.
Information technology — Microprocessor systems — Heterogeneous InterConnect (HIC) (Low-Cost, Low-Latency Scalable Serial Interconnect for Parallel System Construction)
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English
20-07-2000
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This International Standard applies to physical connectors and cables, electrical properties, and logical protocols for point-to-point serial scalable interconnect, operating at speeds of 10 Mbit/s to 200 Mbit/s and at 1 Gbit/s in copper and optic technologies (as developed in Open Microprocessor Systems Initiative/Heterogeneous InterConnect Project (OMI/HIC)).
The object of this International Standard is to enable high-performance, scalable, modular, parallel systems to be constructed with low system integration cost; to support communications systems fabric; to provide a transparent implementation of a range of high-level protocols (communications, e.g. ATM, message passing, shared memory transactions, etc.), and to support links between heterogeneous systems.
| Committee |
ISO/IEC JTC 1/SC 25
|
| DevelopmentNote |
Also numbered as IEEE 1355 (07/2001)
|
| DocumentType |
Standard
|
| Pages |
162
|
| PublisherName |
International Organization for Standardization
|
| Status |
Current
|
| Standards | Relationship |
| NEN ISO/IEC 14575 : 2000 | Identical |
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| IEC 60512-8:1993 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 8: Connector tests (mechanical) and mechanical tests on contacts and terminations |
| IEC 60512-6:1984 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 6: Climatic tests and soldering tests |
| IEC 60793-2:2015 | Optical fibres - Part 2: Product specifications - General |
| IEC 61196-2:1995 | Radio-frequency cables - Part 2: Sectional specification for semi-rigid radio-frequency and coaxial cables with polytetrafluoroethylene (PTFE) insulation |
| IEC 60793-1:1992 | Optical fibres - Part 1: Generic specification |
| IEC 60512-7:1993 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 7: Mechanical operating tests and sealing tests |
| IEC 60825-1:2014 | Safety of laser products - Part 1: Equipment classification and requirements |
| IEC 61000-4-4:2012 RLV | Electromagnetic compatibility (EMC) - Part 4-4: Testing and measurement techniques - Electrical fast transient/burst immunity test |
| CISPR 22:2008 | Information technology equipment - Radio disturbance characteristics - Limits and methods of measurement |
| IEC 60874-1:2011 | Fibre optic interconnecting devices and passive components - Connectors for optical fibres and cables - Part 1: Generic specification |
| IEC 60352-5:2012 | Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance |
| IEC 61076-4:1995 | Connectors with assessed quality, for use in d.c., low-frequency analogue and in digital high-speed data applications - Part 4: Sectional specification - Printed board connectors |
| IEC 61156-1:2007+AMD1:2009 CSV | Multicore and symmetrical pair/quad cables for digital communications - Part 1: Generic specification |
| IEC 60512-4:1976 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 4: Dynamic stress tests |
| IEC 61076-4-101:2001 | Connectors for electronic equipment - Part 4-101: Printed board connectors with assessed quality - Detail specification for two-part connector modules, having a basic grid of 2,0 mm for printed boards and backplanes in accordance with IEC 60917 |
| IEC 60512-9:1992 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 9: Miscellaneous tests |
| IEC 61196-1:2005 | Coaxial communication cables - Part 1: Generic specification - General, definitions and requirements |
| IEC 61754-6:2013 | Fibre optic interconnecting devices and passive components - Fibre optic connector interfaces - Part 6: Type MU connector family |
| IEC 60512-5:1992 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 5: Impact tests (free components), static load tests (fixed components), endurance tests and overload tests |
| IEC 60512-3:1976 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 3: Current-carrying capacity tests |
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