JIS C 60068-2-69:2019
Current
Current
The latest, up-to-date edition.
Environmental testing -- Part 2-69: Tests -- Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
Amended by
Available format(s)
PDF
Language(s)
English
Published date
20-03-2019
Publisher
€69.72
Excluding VAT
This Standard outlines test Te (Solderability testing of printed board) and test Tc [Solderability testing by balancing method, with assessment based on quantitative assessment criteria (wetting time and wettability)], the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations on electronic components and printed boards.
| DocumentType |
Standard
|
| Pages |
0
|
| ProductNote |
NEW CHILD AMD 1 2021 IS NOW ADDED
|
| PublisherName |
Japanese Standards Association
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC 60068-2-69:2017 | Identical |
| JIS C 5101-1:2023 | Fixed capacitors for use in electronic equipment -- Part 1: Generic specification |
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