JIS C 6471:1995
Current
The latest, up-to-date edition.
Test methods of copper-clad laminates for flexible printed wiring boards
Hardcopy , PDF
English, Japanese
30-04-1995
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This Japanese Industrial Standard specifies test methods of copper-clad laminates for flexible printed wiring boards (hereafter referred to as "copper-clad laminates").
| DocumentType |
Test Method
|
| Pages |
35
|
| PublisherName |
Japanese Standards Association
|
| Status |
Current
|
Reaffirmed 2014 1995(R2014) [20/10/2014]1995(R2009) [01/10/2009]1995(R2000) [20/03/2000]1995 [01/03/1995]1990
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| JIS C 6472:1995 | Copper-clad laminates for flexible printed wiring boards (Polyester film, Polyimide film) |
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