JIS Z 3284-1:2024
Current
Current
The latest, up-to-date edition.
Solder paste -- Part 1: Kinds and quality classification
Available format(s)
PDF
Language(s)
English
Published date
22-01-2024
Publisher
Excluding VAT
This Standard specifies requirements for the kinds and quality classification of solder pastes mainly used for wiring connections in electrical equipment, electronic equipment, communication equipment or the like, and for the manufacture and production of their components.
| DocumentType |
Standard
|
| Pages |
15
|
| PublisherName |
Japanese Standards Association
|
| Status |
Current
|
| Supersedes |
| JIS Z 3197:2021 | Test methods for soldering fluxes |
| JIS Z 3001-3:2008 | Welding and allied processes -- Vocabulary -- Part 3: Soldering and brazing |
| JIS Z 3284-2:2014 | Solder paste -- Part 2: Test methods for solder particle shape, surface condition judgment, and particle size distribution |
| JIS Z 3282:2017 | Soft solders -- Chemical compositions and forms |
| JIS Z 3284-3:2014 | Solder paste -- Part 3: Test methods for printability, viscosity, slump and tackiness |
| JIS Z 3001-1:2018 | Welding and allied processes -- Vocabulary -- Part 1: General |
| JIS Z 3284-4:2014 | Solder paste -- Part 4: Test methods for wettability, solderball and spread |
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