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  • MIL D 83532 : A (3) SUPP 1

    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

    DELAY LINES, ACTIVE

    Available format(s): 

    Superseded date:  30-12-1991

    Language(s): 

    Published date:  12-01-2013

    Publisher:  US Military Specs/Standards/Handbooks

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    Abstract - (Show below) - (Hide below)

    Covers requirements for fixed (tapped and untapped) pulse delay lines.

    General Product Information - (Show below) - (Hide below)

    Committee FSC 5999
    Document Type Standard
    Publisher US Military Specs/Standards/Handbooks
    Status Superseded

    Standards Referenced By This Book - (Show below) - (Hide below)

    MIL-STD-1837 Revision B:1991 MISCELLANEOUS ELECTRICAL AND ELECTRONIC COMPONENTS, SELECTION AND USE OF
    MIL D 83532/4 : A DELAY LINES, 14 PIN DIP COMPATIBLE, 3 DELAY CIRCUITS PER PACKAGE
    MIL D 83532/5 : (1) DELAY LINES, ACTIVE, 16-PIN DIP COMPATIBLE, PROGRAMMABLE 3-BIT, TTL COMPATIBLE
    MIL D 83532/1 : A DELAY LINES, 14 PIN DIP COMPATIBLE, 5 TAP
    MIL D 83532/3 : A DELAY LINES, 14 PIN DIP COMPATIBLE, 10 TAP
    MIL D 83532/2 : B DELAY LINES, 14 PIN DIP COMPATIBLE, 5 TAP
    MIL-M-55565 Revision C:1988 MICROCIRCUITS, PACKAGING OF
    MIL D 83532/6 : (1) DELAY LINES, ACTIVE, 16-PIN DIP COMPATIBLE, PROGRAMMABLE 3-BIT, EMITTER-COUPLED LOGIC

    Standards Referencing This Book - (Show below) - (Hide below)

    MIL-STD-1772 Revision B:1990 CERTIFICATION REQUIREMENTS FOR HYBRID MICROCIRCUITS FACILITIES AND LINES
    MIL-M-55565 Revision C:1988 MICROCIRCUITS, PACKAGING OF
    MIL-STD-883 Revision K:2016 TEST METHOD STANDARD - MICROCIRCUITS
    MIL-STD-810 Revision G:2008 ENVIRONMENTAL ENGINEERING CONSIDERATIONS AND LABORATORY TESTS
    MIL-STD-1276 Revision H:2013 Leads for Electronic Component Parts
    DOD STD 100 : C NOTICE 6 ENGINEERING DRAWING PRACTICES
    MIL-STD-1686 Revision C:1995 ELECTROSTATIC DISCHARGE CONTROL PROGRAM FOR PROTECTION OF ELECTRICAL AND ELECTRONIC PARTS, ASSEMBLIES AND EQUIPMENT (EXCLUDING ELECTRICALLY INITIATED EXPLOSIVE DEVICES)
    MIL-STD-45662 Revision A:1988 CALIBRATION SYSTEMS REQUIREMENTS
    MIL-M-38510 Revision J:1991 MICROCIRCUITS, SPECIFICATION FOR
    J-W-1177 Revision B:1988 WIRE, MAGNET, ELECTRICAL, GENERAL SPECIFICATION
    MIL-STD-790 Revision G:2011 ESTABLISHED RELIABILITY AND HIGH RELIABILITY QUALIFIED PRODUCTS LIST (QPL) SYSTEMS FOR ELECTRICAL, ELECTRONIC, AND FIBER OPTIC PARTS SPECIFICATIONS
    QQ-S-571 Revision F:1994 SOLDER, ELECTRONIC (96 TO 485 DEGREES C)
    MIL S 19500 : J SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR
    MIL C 123 : B CAPACITORS, FIXED, CERAMIC DIELECTRIC, (TEMPERATURE STABLE AND GENERAL PURPOSE), HIGH RELIABILITY, GENERAL SPECIFICATION FOR
    MIL H 38534 : B (1) HYBRID MICROCIRCUITS, GENERAL SPECIFICATION FOR
    MIL C 55681 : D SUPP 1 CAPACITOR, CHIP, MULTIPLE LAYER, FIXED UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
    MIL-F-14256 Revision F:1993 FLUX, SOLDERING, LIQUID (ROSIN BASE)
    MIL R 55342 : C RESISTORS, FIXED, FILM, CHIP, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
    MIL-STD-202 Revision H:2015 ELECTRONIC AND ELECTRICAL COMPONENT PARTS
    MIL-STD-1285 Revision D:2004 MARKING OF ELECTRICAL AND ELECTRONIC PARTS
    MIL-STD-105 Revision E:1989 SAMPLING PROCEDURES AND TABLES FOR INSPECTION BY ATTRIBUTES
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