MIL H 38534 : B (1)
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
HYBRID MICROCIRCUITS, GENERAL SPECIFICATION FOR
23-08-1995
12-01-2013
Specification for hybrid microcircuits, including quality and reliability requirements. Coverage includes applicable documents, traceability, visual examination, wire bond strength testing, visual inspection, radiation testing equipment, passive elements, wire bond strength, test equipment verification, manufacturer imposed tests, element evaluation, and location of element evaluation. Also gives detailed tables.
| Committee |
FSC 5962
|
| DevelopmentNote |
Supersedes MIL M 38534 (07/2004)
|
| DocumentType |
Standard
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| MIL-STD-975 Revision M:1994 | NASA STANDARD (EEE) PARTS LIST |
| GEIA TA HB 0009 : 2013 | RELIABILITY PROGRAM HANDBOOK |
| MIL-STD-1547 Revision B:1992 | ELECTRONIC PARTS, MATERIALS, AND PROCESSES FOR SPACE VEHICLES |
| MIL-HDBK-338 Revision B:1998 | ELECTRONIC RELIABILITY DESIGN HANDBOOK |
| MIL R 28750 : C SUPP 1 | RELAYS, SOLID STATE, SEALED, OPTICALLY ISOLATED, ZERO VOLTAGE TURN ON, 25 AMPERES, 250 VOLTS MAXIMUM, 45-440 HZ, POWER SWITCHING |
| MIL D 83532 : A (3) SUPP 1 | DELAY LINES, ACTIVE |
| MIL BULL 103 : AC NOTICE 1 | LIST OF STANDARD MICROCIRCUIT DRAWINGS |
| MIL-M-38510-136 Revision A:1995 | MICROCIRCUITS, LINEAR, PRECISION VOLTAGE REFERENCES, MONOLITHIC SILICON |
| MIL D 83532/5 : (1) | DELAY LINES, ACTIVE, 16-PIN DIP COMPATIBLE, PROGRAMMABLE 3-BIT, TTL COMPATIBLE |
| MIL D 83532/1 : A | DELAY LINES, 14 PIN DIP COMPATIBLE, 5 TAP |
| MIL-HDBK-814 Base Document:1994 | IONIZING DOSE AND NEUTRON HARDNESS ASSURANCE GUIDELINES FOR MICROCIRCUITS AND SEMICONDUCTOR DEVICES |
| MIL-STD-1772 Revision B:1990 | CERTIFICATION REQUIREMENTS FOR HYBRID MICROCIRCUITS FACILITIES AND LINES |
| MIL D 83532/3 : A | DELAY LINES, 14 PIN DIP COMPATIBLE, 10 TAP |
| MIL D 83532/2 : B | DELAY LINES, 14 PIN DIP COMPATIBLE, 5 TAP |
| MIL-STD-1562 Revision W:1991 | LISTS OF STANDARD MICROCIRCUITS |
| MIL O 55310 : C | OSCILLATOR, CRYSTAL, GENERAL SPECIFICATION FOR |
| MIL D 83532/6 : (1) | DELAY LINES, ACTIVE, 16-PIN DIP COMPATIBLE, PROGRAMMABLE 3-BIT, EMITTER-COUPLED LOGIC |
| MIL-M-24791-1 Base Document:1995 | MODULE, FIBER OPTIC, TRANSMITTER, DIGITAL, 160 MBD, ASSOCIATED DETAIL SPECIFICATION FOR |
| MIL-P-24764 Base Document:1991 | POWER SUPPLIES, SHIPBOARD, ELECTRONIC, GENERAL SPECIFICATION FOR |
| MIL-STD-1772 Revision B:1990 | CERTIFICATION REQUIREMENTS FOR HYBRID MICROCIRCUITS FACILITIES AND LINES |
| MIL-STD-280 Revision A:1969 | DEFINITIONS OF ITEM LEVELS, ITEM EXCHANGEABILITY, MODELS, AND RELATED TERMS |
| MIL-STD-883 Revision K:2016 | TEST METHOD STANDARD - MICROCIRCUITS |
| MIL-STD-975 Revision M:1994 | NASA STANDARD (EEE) PARTS LIST |
| ASTM F 30 : 1996 | Standard Specification for Iron-Nickel Sealing Alloys |
| MIL-STD-45662 Revision A:1988 | CALIBRATION SYSTEMS REQUIREMENTS |
| MIL-STD-750 Revision F:2011 | TEST METHODS FOR SEMICONDUCTOR DEVICES |
| FED-STD-209 Revision E:1992 | AIRBORNE PARTICULATE CLEANLINESS CLASSES IN CLEANROOMS AND CLEAN ZONES |
| ASTM B 567 : 1998 | Standard Test Method for Measurement of Coating Thickness by the Beta Backscatter Method |
| MIL-STD-1520 Revision C:1986 | CORRECTIVE ACTION AND DISPOSITION SYSTEM FOR NONCONFORMING MATERIAL |
| MIL-STD-977 Base Document:1982 | TEST METHODS AND PROCEDURES FOR MICROCIRCUIT LINE CERTIFICATION |
| MIL-STD-100 Revision G:1997 | ENGINEERING DRAWINGS |
| MIL-STD-1331 Base Document:1969 | PARAMETER TO BE CONTROLLED FOR THE SPECIFICATION OF MICROCIRCUITS |
| MIL-STD-202 Revision H:2015 | ELECTRONIC AND ELECTRICAL COMPONENT PARTS |
| MIL-STD-1285 Revision D:2004 | MARKING OF ELECTRICAL AND ELECTRONIC PARTS |
| MIL-STD-976 Revision B:1988 | CERTIFICATION REQUIREMENTS FOR JAN MICROCIRCUITS |
| MIL-STD-1835 Revision D:2004 | ELECTRONIC COMPONENT CASE OUTLINES |
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