MIL-STD-202-302 Base Document:2015
|
METHOD 302, INSULATION RESISTANCE |
MIL-STD-883 Revision K:2016
|
TEST METHOD STANDARD - MICROCIRCUITS |
MIL-STD-810 Revision G:2008
|
ENVIRONMENTAL ENGINEERING CONSIDERATIONS AND LABORATORY TESTS |
ANSI/NCSL Z540 3 : 2006(R2013)
|
REQUIREMENTS FOR THE CALIBRATION OF MEASURING AND TEST EQUIPMENT |
MIL-STD-202-210 Base Document:2015
|
METHOD 210, RESISTANCE TO SOLDERING HEAT |
MIL-STD-202-303 Base Document:2015
|
METHOD 303, DC RESISTANCE |
IPC J STD 006 : C
|
REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
MIL-STD-202-107 Base Document:2015
|
METHOD 107, THERMAL SHOCK |
IPC J STD 004 : B
|
REQUIREMENTS FOR SOLDERING FLUXES |
MIL-STD-202-106 Base Document:2015
|
METHOD 106, MOISTURE RESISTANCE |
MIL-STD-202-301 Base Document:2015
|
METHOD 301, DIELECTRIC WITHSTANDING VOLTAGE |
IPC J STD 005 : A
|
REQUIREMENTS FOR SOLDERING PASTES |
MIL-STD-790 Revision G:2011
|
ESTABLISHED RELIABILITY AND HIGH RELIABILITY QUALIFIED PRODUCTS LIST (QPL) SYSTEMS FOR ELECTRICAL, ELECTRONIC, AND FIBER OPTIC PARTS SPECIFICATIONS |
ISO 10012:2003
|
Measurement management systems — Requirements for measurement processes and measuring equipment |
MIL-STD-202-108 Base Document:2015
|
METHOD 108, LIFE (AT ELEVATED AMBIENT TEMPERATURE) |
MIL-STD-202-105 Base Document:2015
|
METHOD 105, BAROMETRIC PRESSURE (REDUCED) |
MIL-STD-202-208 Base Document:2015
|
METHOD 208, SOLDERABILITY |
MIL-STD-202 Revision H:2015
|
ELECTRONIC AND ELECTRICAL COMPONENT PARTS |
MIL-STD-1285 Revision D:2004
|
MARKING OF ELECTRICAL AND ELECTRONIC PARTS |
MIL-STD-690 Revision D:2005
|
Failure Rate (FR) Sampling Plans and Procedures |
MIL-STD-202-204 Base Document:2015
|
METHOD 204, VIBRATION, HIGH FREQUENCY |
MIL-STD-202-213 Base Document:2015
|
METHOD 213, SHOCK (SPECIFIED PULSE) |