NBN EN 61189-6 : 2007

INTRODUCTION
1 Scope
2 Normative references
3 Accuracy, precision and resolution
   3.1 Accuracy
   3.2 Precision
   3.3 Resolution
   3.4 Report
   3.5 Student's "t" distribution
   3.6 Suggested uncertainty limits
4 Catalogue of approved test methods
5 P: Preparation/conditioning test methods
6 V: Visual test methods
7 D: Dimensional test methods
8 C: Chemical test methods
   8.1 Test 6C01: Determination of acid value of liquid
        soldering flux - potentiometric and visual titration
        methods
   8.2 Test 6C02: Determination of halides in fluxes,
        silver chromate method
   8.3 Test 6C03: Solids content, flux
   8.4 Test 6C04: Quantitative determination of halide
        content in fluxes (chloride and bromide)
   8.5 Test 6C05: Qualitative analysis of fluorides and
        fluxes by spot test
   8.6 Test 6C06: Quantitative determination of fluoride
        concentration in fluxes
   8.7 Test 6C07: Acid number of rosin
   8.8 Test 6C08: Specific gravity
   8.9 Test 6C09: Determination of the percentage of flux on/in
        flux-coated and/or flux-cored solder
   8.10 Test 6C10: Flux induced corrosion (copper mirror method)
9 M: Mechanical test methods
10 E: Electrical test methods
11 N: Environmental test methods
12 X: Miscellaneous test methods
   12.1 Test 6X01: Determination of solder powder particle
        size distribution - Screen method for types 1-4
   12.2 Test 6X02: Solder powder particle size
        distribution-measuring microscope method
   12.3 Test 6X03: Solder powder particle size distribution -
        Optical image analyzer method
   12.4 Test 6X04: Solder powder particle size distribution -
        Measuring laser diffraction method
   12.5 Test 6X05: Determination of maximum solder powder
        particle size
   12.6 Test 6X06: Solder paste metal content by weight
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications

Presents a catalogue of test methods representing methodologies and procedures that can be applied to materials used in manufacturing electronic assemblies.