NBN EN 61192-4 : 2004
Current
The latest, up-to-date edition.
WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 4: TERMINAL ASSEMBLIES
12-01-2013
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
4.1 Classification
4.2 Conflict
4.3 Inspection technique
4.4 Interpretation of requirements
5 Process characterization
5.1 Wire preparation processes
5.2 Terminal mounting processes
5.3 Soldering terminal
5.4 Solderability
5.5 Preconditioning
5.6 Mechanical securing
6 Wire preparation attributes
6.1 Insulation stripping
6.2 Twisted strands
7 Connector pins and terminals
7.1 Soldered connector pins
8 Discrete wiring (jumper wires)
8.1 Wire selection
8.2 Wire routing
8.3 Staking
8.4 Termination
9 Discrete wiring (jumper wires) attributes
10 Solder joint acceptance
10.1 Post terminations
Figures
Table
Specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates.
| DocumentType |
Standard
|
| PublisherName |
Belgian Standards
|
| Status |
Current
|
| Standards | Relationship |
| DIN EN 61192-4:2003-11 | Identical |
| EN 61192-4:2003 | Identical |
| BS EN 61192-4:2003 | Identical |
| I.S. EN 61192-4:2003 | Identical |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.