• BS EN 61192-4 : 2003

    Current The latest, up-to-date edition.

    WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 4: TERMINAL ASSEMBLIES

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-2003

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 General requirements
       4.1 Classification
       4.2 Conflict
       4.3 Inspection technique
       4.4 Interpretation of requirements
    5 Process characterization
       5.1 Wire preparation processes
       5.2 Terminal mounting processes
       5.3 Soldering terminal
       5.4 Solderability
       5.5 Preconditioning
       5.6 Mechanical securing
    6 Wire preparation attributes
       6.1 Insulation stripping
       6.2 Twisted strands
    7 Connector pins and terminals
       7.1 Soldered connector pins
    8 Discrete wiring (jumper wires)
       8.1 Wire selection
       8.2 Wire routing
       8.3 Staking
       8.4 Termination
    9 Discrete wiring (jumper wires) attributes
    10 Solder joint acceptance
       10.1 Post terminations
    Figures
    Table

    Abstract - (Show below) - (Hide below)

    Specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates.

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    Committee EPL/501
    Development Note Supersedes 98/232816 DC (07/2003)
    Document Type Standard
    Publisher British Standards Institution
    Status Current
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    EN 60749 : 99 AMD 2 2001 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS
    EN 61189-3:2008 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS)
    IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
    IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    IEC 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
    EN 61192-3 : 2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    IEC 60749:1996+AMD1:2000+AMD2:2001 CSV Semiconductor devices - Mechanical and climatic test methods
    IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
    EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
    IEC 61192-2:2003 Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
    EN 61192-1 : 2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 1: GENERAL
    EN 61191-4:2017 PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
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