EN 61192-4:2003

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Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies

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Withdrawn date: 01-03-2006

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Published date: 25-03-2003

Publisher: European Committee for Standards - Electrical

Pure ENs are not available for sale, please purchase a suitable national adoption

Table of Contents - (Show below) - (Hide below)

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
   4.1 Classification
   4.2 Conflict
   4.3 Inspection technique
   4.4 Interpretation of requirements
5 Process characterization
   5.1 Wire preparation processes
   5.2 Terminal mounting processes
   5.3 Soldering terminal
   5.4 Solderability
   5.5 Preconditioning
   5.6 Mechanical securing
6 Wire preparation attributes
   6.1 Insulation stripping
   6.2 Twisted strands
7 Connector pins and terminals
   7.1 Soldered connector pins
8 Discrete wiring (jumper wires)
   8.1 Wire selection
   8.2 Wire routing
   8.3 Staking
   8.4 Termination
9 Discrete wiring (jumper wires) attributes
10 Solder joint acceptance
   10.1 Post terminations
Figures
Table

Abstract - (Show below) - (Hide below)

Specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally terminals or mixed assemblies that include surface-mounting or other related assembly technologies, for example through-hole, wires.

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Committee	CLC/SR 91
Development Note	To be used in conjunction with EN 61192-1, 61192-2 & EN 61192-3 (07/2003)
Document Type	Standard
ISBN
Pages
Published
Publisher	European Committee for Standards - Electrical
Status	Withdrawn

National Adoptions - (Show below) - (Hide below)

Equivalent Standard(s)	Relationship
IEC 61192-4:2002	Identical
NBN EN 61192-4 : 2004	Identical
NF EN 61192-4 : 2003	Identical
NEN EN IEC 61192-4 : 2003	Identical
I.S. EN 61192-4:2003	Identical
PN EN 61192-4 : 2007	Identical
UNE-EN 61192-4:2003	Identical
BS EN 61192-4:2003	Identical
CEI EN 61192-4 : 2003	Identical
DIN EN 61192-4:2003-11	Identical

Standards Referenced By This Book - (Show below) - (Hide below)

BS EN 61192-1:2003	Workmanship requirements for soldered electronic assemblies General
I.S. EN 61192-3:2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES
I.S. EN 61192-1:2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL
EN 61192-3:2003	Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
I.S. EN 61192-2:2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - SURFACE-MOUNT ASSEMBLIES
I.S. EN 61192-5:2007	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
BS EN 61192-3:2003	Workmanship requirements for soldered electronic assemblies Through-hole mount assemblies
BS EN 61192-5:2007	Workmanship requirements for soldered electric assemblies Rework, modification and repair of soldered electronic assemblies
BS EN 61192-2:2003	Workmanship requirements for soldered electronic assemblies Surface-mount assemblies
EN 61192-5 : 2007	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
EN 61192-2:2003	Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
EN 61192-1:2003	Workmanship requirements for soldered electronic assemblies - Part 1: General

Standards Referencing This Book - (Show below) - (Hide below)

IEC 61192-3:2002	Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
EN 60749 : 99 AMD 2 2001	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS
EN 61189-3:2008	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
IEC 61189-3:2007	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
IEC 61191-1:2013	Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 61192-1:2003	Workmanship requirements for soldered electronic assemblies - Part 1: General
EN 61192-3:2003	Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
IEC 60194:2015	Printed board design, manufacture and assembly - Terms and definitions
IEC 60749:1996+AMD1:2000+AMD2:2001 CSV	Semiconductor devices - Mechanical and climatic test methods
IEC 61191-4:2017	Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
EN 61191-1:2013	PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
IEC 61192-2:2003	Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
EN 61192-1:2003	Workmanship requirements for soldered electronic assemblies - Part 1: General
EN 61191-4:2017	Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

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