NEN EN IEC 60068-2-69 : 2017
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ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD
Amended by
Published date
12-01-2013
Publisher
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Outlines test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices.
| DevelopmentNote |
Supersedes NEN 10068-2-69. (07/2007) Supersedes NEN EN IEC 60068-2-54. (07/2017)
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| DocumentType |
Standard
|
| ProductNote |
NEW CHILD AMD 1 2019 IS ADDED.
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| PublisherName |
Netherlands Standards
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| Status |
Current
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| Supersedes |
| Standards | Relationship |
| IEC 60068-2-69:2017 | Identical |
| EN 60068-2-69:2017/AC:2018-03 | Identical |
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