• EN 60068-2-69:2017/AC:2018-03

    Current The latest, up-to-date edition.

    ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017/COR1:2018)

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    Published date:  09-03-2018

    Publisher:  European Committee for Standards - Electrical

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 General description of the method
    5 Description of the test apparatus
    6 Preparation of specimens
    7 Materials
    8 Procedure
    9 Presentation of results
    10 Information to be given in the relevant specification
    Annex A (normative) - Equipment specification
    Annex B (informative) - Use of the wetting balance for
            SMD solderability testing
    Annex C (normative) - Test methods for SMD components
            sizes 0603M (0201) or smaller
    Annex D (informative) - Evaluation criteria - Guidance
    Annex E (informative) - Method of calculating the maximum
            theoretical force and integrated value of the area of the
            wetting curve for leaded non-SMD
    Bibliography
    Annex ZA (normative) - Normative references to
             international publications with their
             corresponding European publications

    Abstract - (Show below) - (Hide below)

    Defines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations.

    General Product Information - (Show below) - (Hide below)

    Committee SR 91
    Development Note Supersedes EN 60068-2-54. (06/2017)
    Document Type Standard
    Publisher European Committee for Standards - Electrical
    Status Current
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    EN 60068-2-20 : 2008 ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
    EN 60068-2-2:2007 ENVIRONMENTAL TESTING - PART 2-2: TESTS - TEST B: DRY HEAT
    EN 60068-1:2014 ENVIRONMENTAL TESTING - PART 1: GENERAL AND GUIDANCE (IEC 60068-1:2013)
    IEC 60068-2-66:1994 Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)
    ISO 9454-1:2016 Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging
    J STD 002 : D SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
    IEC 60068-3-13:2016 Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering
    IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
    IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
    ISO 9453:2014 Soft solder alloys Chemical compositions and forms
    EN 60068-2-66:1994 ENVIRONMENTAL TESTING - PART 2: TEST METHODS - TEST CX: DAMP HEAT, STEADY STATE (UNSATURATED PRESSURIZED VAPOUR)
    EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
    J STD 003 : C SOLDERABILITY TESTS FOR PRINTED BOARDS
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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