NEN EN IEC 60068-2-83 : 2011
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ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE
Published date
12-01-2013
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Defines methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes.
| DocumentType |
Standard
|
| PublisherName |
Netherlands Standards
|
| Status |
Current
|
| Standards | Relationship |
| IEC 60068-2-83:2011 | Identical |
| EN 60068-2-83 : 2011 | Identical |
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