Skip to content
Please enter a keyword to search

  • IEC 60068-2-83:2011

    Current The latest, up-to-date edition.

    Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French

    Published date:  07-09-2011

    Publisher:  International Electrotechnical Committee

    Add To Cart

    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Test
    5 Preconditioning
    6 Preparation
    7 Quick heating method
    8 Synchronous method
    9 Temperature profile method
    Annex A (normative) - Equipment for the quick heating
            and synchronous method
    Annex B (informative) - Reading of the output data and
            correction of the result in the quick heating test
    Annex C (normative) - Test equipment for the temperature
            profile method
    Annex D (informative) - Reading of the output data and
            correction of the result in the temperature
            profile test
    Annex E (informative) - Caveats/Notes
    Bibliography

    Abstract - (Show below) - (Hide below)

    IEC 60068-2-83:2011 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass - fail purposes.
    NOTE: Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using solder bath and solder globule method.

    General Product Information - (Show below) - (Hide below)

    Committee TC 91
    Development Note Stability date: 2020. (09/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    EN 60068-3-13:2016 Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering
    CEI EN 60068-3-13 : 1ED 2017 ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING
    11/30252855 DC : 0 BS EN 60068-3-13 - ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T: SOLDERING
    BS EN 60068-3-13:2016 Environmental testing Supporting documentation and guidance on Test T. Soldering
    I.S. EN 60068-3-13:2016 ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING
    IEC 60068-3-13:2016 Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    IEC 61189-5:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    IEC 60068-2-69:2017 Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
    View more information

    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective