EN 60068-2-83 : 2011

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ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE (IEC 60068-2-83:2011)

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Published date: 14-10-2011

Publisher: European Committee for Standards - Electrical

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Table of Contents - (Show below) - (Hide below)

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Test
5 Preconditioning
6 Preparation
7 Quick heating method
8 Synchronous method
9 Temperature profile method
Annex A (normative) - Equipment for the quick
        heating and synchronous method
Annex B (informative) - Reading of the output
        data and correction of the result in the
        quick heating test
Annex C (normative) - Test equipment for the
        temperature profile method
Annex D (informative) - Reading of the output
        data and correction of the result in the
        temperature profile test
Annex E (informative) - Caveats/Notes
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Abstract - (Show below) - (Hide below)

Gives methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes.

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Committee	SR 91
Document Type	Standard
ISBN
Pages
Published
Publisher	European Committee for Standards - Electrical
Status	Current

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Equivalent Standard(s)	Relationship
IEC 60068-2-83:2011	Identical
DIN EN 60068-2-83:2012-07	Identical
PN EN 60068-2-83 : 2011	Identical
NEN EN IEC 60068-2-83 : 2011	Identical
BS EN 60068-2-83:2011	Identical
I.S. EN 60068-2-83:2011	Identical
NF EN 60068-2-83 : 2012	Identical
UNE-EN 60068-2-83:2011	Identical
CEI EN 60068-2-83 : 2012	Identical
NBN EN 60068-2-83 : 2011	Identical
BS EN 61784-5-12:2012+A1:2015	Identical

Standards Referenced By This Book - (Show below) - (Hide below)

EN 60068-3-13:2016	Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering
CEI EN 60068-3-13 : 1ED 2017	ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING
BS EN 60068-3-13:2016	Environmental testing Supporting documentation and guidance on Test T. Soldering
I.S. EN 60068-3-13:2016	ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING

Standards Referencing This Book - (Show below) - (Hide below)

IEC 60068-1:2013	Environmental testing - Part 1: General and guidance
IEC 60068-2-58:2015+AMD1:2017 CSV	Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
EN 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
EN 60068-1:2014	Environmental testing - Part 1: General and guidance
IEC 61189-5:2006	Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
IEC 60194:2015	Printed board design, manufacture and assembly - Terms and definitions
EN 61190-1-3:2007/A1:2010	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
IEC 60068-2-69:2017	Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
EN 60194:2006	Printed board design, manufacture and assembly - Terms and definitions
IEC 61190-1-3:2007+AMD1:2010 CSV	Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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