NEN EN IEC 60191-6-1 : 2002
Current
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR GULL-WING LEAD TERMINALS
Published date
12-01-2013
Publisher
Sorry this product is not available in your region.
Includes the requirements for the design rule of terminal shape plastic packages with gull-wing leads; e.g., QFP, SOP, SSOP, TSOP, etc. which are packages classified as Form E in IEC 60191-4.
| DocumentType |
Standard
|
| PublisherName |
Netherlands Standards
|
| Status |
Current
|
| Standards | Relationship |
| IEC 60191-6-1:2001 | Identical |
| EN 60191-6-1:2001 | Identical |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.